ProASIC3 Flash Family FPGAs
Revision 13 5-3
Revision 10
(continued)
"TBD" for 3.3 V LVCMOS Wide Range in Table 2-28 • I/O Output Buffer Maximum
Resistances1 through Table 2-30 • I/O Output Buffer Maximum Resistances1 was
replaced by "Same as regular 3.3 V" (SAR 33852).
2-25 to
2-27
The equations in the notes for Table 2-31 • I/O Weak Pull-Up/Pull-Down
Resistances were corrected (SAR 32470).
2-27
"TBD" for 3.3 V LVCMOS Wide Range in Table 2-32 • I/O Short Currents IOSH/IOSL
through Table 2-34 • I/O Short Currents IOSH/IOSL was replaced by "Same as
regular 3.3 V LVCMOS" (SAR 33852).
2-28 to
2-30
In the "3.3 V LVCMOS Wide Range" section, values were added to Table 2-47
through Table 2-49 for IOSL and IOSH, replacing "TBD" (SAR 33852).
2-38 to
2-39
The following sentence was deleted from the "2.5 V LVCMOS" section (SAR 24916):
"It uses a 5 V–tolerant input buffer and push-pull output buffer."
2-46
The table notes were revised for Table 2-90 • LVDS Minimum and Maximum DC
Input and Output Levels (SAR 33859).
2-65
Values were added for F
DDRIMAX
and F
DDOMAX
in Table 2-102 • Input DDR
Propagation Delays and Table 2-104 • Output DDR Propagation Delays (SAR
23919).
2-77, 2-79
Table 2-115 • ProASIC3 CCC/PLL Specification was updated. A note was added to
indicate that when the CCC/PLL core is generated by Microsemi core generator
software, not all delay values of the specified delay increments are available (SAR
25705).
2-89
The following figures were deleted (SAR 29991). Reference was made to a new
application note, Simultaneous Read-Write Operations in Dual-Port SRAM for
Flash-Based cSoCs and FPGA
s, which covers these cases in detail (SAR 21770).
Figure 2-34 • Write Access after Write onto Same Address
Figure 2-35 • Read Access after Write onto Same Address
Figure 2-35 • Read Access after Write onto Same Address
The port names in the SRAM "Timing Waveforms", SRAM "Timing Characteristics"
tables, Figure 2-38 • FIFO Reset, and the FIFO "Timing Characteristics" tables were
revised to ensure consistency with the software names (SARs 29991, 30510).
2-92,
2-94,
2-99,
2-101
The "Pin Descriptions" chapter has been added (SAR 21642). 3-1
Package names used in the "Package Pin Assignments" section were revised to
match standards given in Package Mechanical Drawings (SAR 27395).
4-1
July 2010 The versioning system for datasheets has been changed. Datasheets are assigned
a revision number that increments each time the datasheet is revised. The
"ProASIC3 Device Status" table on page III indicates the status for each device in
the device family.
N/A
Revision Changes Page