ProASIC3 DC and Switching Characteristics
2-6 Revision 13
Temperature and Voltage Derating Factors
Calculating Power Dissipation
Quiescent Supply Current
Power per I/O Pin
Table 2-6 • Temperature and Voltage Derating Factors for Timing Delays
(normalized to T
J
= 70°C, VCC = 1.425 V)
Array Voltage VCC
(V)
Junction Temperature (°C)
–40°C 0°C 25°C 70°C 85°C 100°C
1.425 0.88 0.93 0.95 1.00 1.02 1.04
1.500 0.83 0.88 0.90 0.95 0.96 0.98
1.575 0.80 0.84 0.87 0.91 0.93 0.94
Table 2-7 • Quiescent Supply Current Characteristics
A3P015 A3P030 A3P060 A3P125 A3P250 A3P400 A3P600 A3P1000
Typical (25°C) 2 mA 2 mA 2 mA 2 mA 3 mA 3 mA 5 mA 8 mA
Max. (Commercial) 10 mA 10 mA 10 mA 10 mA 20 mA 20 mA 30 mA 50 mA
Max. (Industrial) 15 mA 15 mA 15 mA 15 mA 30 mA 30 mA 45 mA 75 mA
Note: IDD Includes VCC, VPUMP, VCCI, and VMV currents. Values do not include I/O static
contribution, which is shown in Table 2 -11 and Table 2-12 on page 2-8.
Table 2-8 • Summary of I/O Input Buffer Power (Per Pin) – Default I/O Software Settings
Applicable to Advanced I/O Banks
VMV (V)
Static Power
P
DC2
(mW)
1
Dynamic Power
PAC9 (µW/MHz)
2
Single-Ended
3.3 V LVTTL / 3.3 V LVCMOS 3.3 – 16.22
3.3 V LVCMOS Wide Range
3
3.3 – 16.22
2.5 V LVCMOS 2.5 – 5.12
1.8 V LVCMOS 1.8 – 2.13
1.5 V LVCMOS (JESD8-11) 1.5 – 1.45
3.3 V PCI 3.3 – 18.11
3.3 V PCI-X 3.3 – 18.11
Differential
LVDS 2.5 2.26 1.20
LVPECL 3.3 5.72 1.87
Notes:
1. PDC2 is the static power (where applicable) measured on VMV.
2. PAC9 is the total dynamic power measured on VCC and VMV.
3. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JESD8-B
specification.