Revision 13 4-1
4 – Package Pin Assignments
QN48
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
http://www.microsemi.com/soc/products/solutions/package/docs.aspx.
Notes:
1. This is the bottom view of the package.
2. The die attach paddle center of the package is tied to ground (GND).
48
1
Pin 1