SmartFusion Customizable System-on-Chip (cSoC)
Revision 10 2-13
PAC24 Current Monitor Power Contribution See Table 2-93 on
page 2-77
–1.03mW
PAC25 ABPS Power Contribution See Table 2-97 on
page 2-82
–0.70mW
PAC26 Sigma-Delta DAC Power
Contribution
2
See Table 2-99 on
page 2-85
–0.58mW
PAC27 Comparator Power Contribution See Table 2-98 on
page 2-84
–1.02mW
PAC28 Voltage Regulator Power
Contribution
3
See Table 2-100 on
page 2-87
–36.30mW
Notes:
1. For a different use of MSS peripherals and resources, refer to SmartPower.
2. Assumes Input = Half Scale Operation mode.
3. Assumes 100 mA load on 1.5 V domain.
Table 2-15 • Different Components Contributing to the Static Power Consumption in SmartFusion cSoCs
Parameter Definition
Power Supply Device
UnitsName Domain A2F060 A2F200 A2F200
PDC1 Core static power contribution in
SoC mode
VCC 1.5 V 11.10 23.70 37.95 mW
PDC2 Device static power contribution in
Standby Mode
See Ta b le 2- 8 o n
page 2-10
– 11.10 23.70 37.95 mW
PDC3 Device static power contribution in
Time Keeping mode
See Ta b le 2- 8 o n
page 2-10
3.3 V 33.00 33.00 33.00 µW
PDC7 Static contribution per input pin
(standard dependent contribution)
VCCxxxxIOBx/VCC See Tabl e 2 - 10 and Table 2-11 on page 2-11.
PDC8 Static contribution per output pin
(standard dependent contribution)
VCCxxxxIOBx/VCC See Table 2-12 and Table 2-13 on page 2-11.
PDC9 Static contribution per PLL VCC 1.5 V 2.55 2.55 2.55 mW
Table 2-16 • eNVM Dynamic Power Consumption
Parameter Description Condition Min. Typ. Max. Units
eNVM System eNVM array operating power Idle 795 µA
Read operation See Table 2-14 on page 2-12.
Erase 900 µA
Write 900 µA
PNVMCTRL eNVM controller operating power 20 µW/MHz
Table 2-14 • Different Components Contributing to Dynamic Power Consumption in SmartFusion cSoCs
Parameter Definition
Power Supply Device
UnitsName Domain A2F060 A2F200 A2F500
