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A2F060M3F-1CS288YI

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型号: A2F060M3F-1CS288YI
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功能描述: SmartFusion Customizable System-on-Chip (cSoC)
PDF文件大小: 11779.94 Kbytes
PDF页数: 共192页
制造商: MICROSEMI[Microsemi Corporation]
制造商LOGO: MICROSEMI[Microsemi Corporation] LOGO
制造商网址: http://www.microsemi.com
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120%
SmartFusion Customizable System-on-Chip (cSoC)
Revision 10 6-7
Revision 6
(continued)
Dynamic power values were updated in the following tables. The table subtitles
changed where FPGA I/O banks were involved to note "I/O assigned to EMC I/O pins"
(SAR 30987).
Table 2-10 • Summary of I/O Input Buffer Power (per pin) – Default I/O Software
Settings
Table 2-13 • Summary of I/O Output Buffer Power (per pin) – Default I/O Software
Settings.
2-10
2-11
The "Timing Model" was updated (SAR 30986). 2-19
Values in the timing tables for the following sections were updated. Table subtitles
were updated for FPGA I/O banks to note "I/O assigned to EMC I/O pins" (SAR
30986).
"Overview of I/O Performance" section: Tabl e 2 - 24, Table 2-25
"Detailed I/O DC Characteristics" section: Tab le 2 - 38, Tab le 2 -3 9 , Tabl e 2- 4 0,
Table 2-44, Tab le 2 - 45, Tab l e 2- 46 , Ta b le 2 - 50 , Tab le 2- 51, Tab l e 2- 5 2, Tab l e 2- 56 ,
Table 2-57, Table 2-58, Table 2- 6 1, Tab le 2 - 62
"LVDS" section: Ta b le 2- 6 5
"LVPECL" section: Tabl e 2-6 8
"Global Tree Timing Characteristics" section: Tabl e 2 - 80, Ta ble 2 -81
2-23
2-26
2-40
2-42
2-59
The "PQ208" section and pin tables are new (SAR 31005). 5-32
Global clocks were removed from the A2F060 pin table for the "CS288" and "FG256"
packages, resulting in changed function names for affected pins (SAR 31033).
5-40
Revision 5
(December 2010)
Table 2-2 • Analog Maximum Ratings was revised. The recommended CM[n] pad
voltage (relative to ground) was changed from –11 to –0.3 (SAR 28219).
2-2
Table 2-7 • Temperature and Voltage Derating Factors for Timing Delays was revised
to change the values for 100ºC.
2-9
Power-down and Sleep modes, and all associated notes, were removed from
Table 2-8 • Power Supplies Configuration (SAR 29479). IDC3 and IDC4 were
renamed to IDC1 and IDC2 (SAR 29478). These modes are no longer supported. A
note was added to the table stating that current monitors and temperature monitors
should not be used when Power-down and/or Sleep mode are required by the
application.
2-10
The "Power-Down and Sleep Mode Implementation" section was deleted (SAR
29479).
N/A
Values for PAC9 and PAC10 for LVDS and LVPECL were revised in Ta b le 2- 10
Summary of I/O Input Buffer Power (per pin) – Default I/O Software Settings and
Table 2-12 • Summary of I/O Output Buffer Power (per pin) – Default I/O Software
Settings*.
2-10,
2-11
Values for PAC1 through PAC4, PDC1, and PDC2 were added for A2F500 in
Table 2-14 • Different Components Contributing to Dynamic Power Consumption in
SmartFusion cSoCs and Table 2-15 • Different Components Contributing to the Static
Power Consumption in SmartFusion cSoCs
2-12,
2-13
The equation for "Total Dynamic Power Consumption—PDYN" in "SoC Mode" was
revised to add P
MSS
. The "Microcontroller Subsystem Dynamic Contribution—PMSS"
section is new (SAR 29462).
2-14,
2-18
Information in Table 2-24 • Summary of I/O Timing Characteristics—Software Default
Settings (applicable to FPGA I/O banks) and Table 2-25 • Summary of I/O Timing
Characteristics—Software Default Settings (applicable to MSS I/O banks) was
updated.
2-25
Revision Changes Page
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