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A2F060M3D-PQ208Y

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型号: A2F060M3D-PQ208Y
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功能描述: SmartFusion Customizable System-on-Chip (cSoC)
PDF文件大小: 11779.94 Kbytes
PDF页数: 共192页
制造商: MICROSEMI[Microsemi Corporation]
制造商LOGO: MICROSEMI[Microsemi Corporation] LOGO
制造商网址: http://www.microsemi.com
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120%
SmartFusion DC and Switching Characteristics
2-40 Revision 10
Differential I/O Characteristics
Physical Implementation
Configuration of the I/O modules as a differential pair is handled by SoC Products Group Designer
software when the user instantiates a differential I/O macro in the design.
Differential I/Os can also be used in conjunction with the embedded Input Register (InReg), Output
Register (OutReg), Enable Register (EnReg), and Double Data Rate (DDR). However, there is no
support for bidirectional I/Os or tristates with the LVPECL standards.
LVDS
Low-Voltage Differential Signaling (ANSI/TIA/EIA-644) is a high-speed, differential I/O standard. It
requires that one data bit be carried through two signal lines, so two pins are needed. It also requires
external resistor termination.
The full implementation of the LVDS transmitter and receiver is shown in an example in Figure 2-11. The
building blocks of the LVDS transmitter-receiver are one transmitter macro, one receiver macro, three
board resistors at the transmitter end, and one resistor at the receiver end. The values for the three driver
resistors are different from those used in the LVPECL implementation because the output standard
specifications are different.
Along with LVDS I/O, SmartFusion cSoCs also support bus LVDS structure and multipoint LVDS
(M-LVDS) configuration (up to 40 nodes).
Figure 2-11 • LVDS Circuit Diagram and Board-Level Implementation
140
100
Z
0
= 50
Z
0
= 50
165
165
+
P
N
P
N
INBUF_LVDS
OUTBUF_LVDS
FPGA FPGA
Bourns Part Number: CAT16-LV4F12
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