SmartFusion DC and Switching Characteristics
2-24 Revision 10
Summary of I/O Timing Characteristics – Default I/O Software
Settings
Table 2-21 • Summary of Maximum and Minimum DC Input Levels
Applicable to Commercial Conditions in all I/O Bank Types
DC I/O Standards
Commercial
I
IL
I
IH
µA µA
3.3 V LVTTL / 3.3 V LVCMOS 15 15
2.5 V LVCMOS 15 15
1.8 V LVCMOS 15 15
1.5 V LVCMOS 15 15
3.3 V PCI 15 15
3.3 V PCI-X 15 15
Table 2-22 • Summary of AC Measuring Points Applicable to All I/O Bank Types
Standard Measuring Trip Point (V
trip
)
3.3 V LVTTL / 3.3 V LVCMOS 1.4 V
2.5 V LVCMOS 1.2 V
1.8 V LVCMOS 0.90 V
1.5 V LVCMOS 0.75 V
3.3 V PCI 0.285 * VCCxxxxIOBx (RR)
0.615 * VCCxxxxIOBx (FF)
3.3 V PCI-X 0.285 * VCCxxxxIOBx (RR)
0.615 * VCCxxxxIOBx (FF)
LVDS Cross point
LVPECL Cross point
Table 2-23 • I/O AC Parameter Definitions
Parameter Parameter Definition
t
DP
Data to pad delay through the output buffer
t
PY
Pad to data delay through the input buffer
t
DOUT
Data to output buffer delay through the I/O interface
t
EOUT
Enable to output buffer tristate control delay through the I/O interface
t
DIN
Input buffer to data delay through the I/O interface
t
HZ
Enable to pad delay through the output buffer—High to Z
t
ZH
Enable to pad delay through the output buffer—Z to High
t
LZ
Enable to pad delay through the output buffer—Low to Z
t
ZL
Enable to pad delay through the output buffer—Z to Low
t
ZHS
Enable to pad delay through the output buffer with delayed enable—Z to High
t
ZLS
Enable to pad delay through the output buffer with delayed enable—Z to Low