SmartFusion Customizable System-on-Chip (cSoC)
VI Revision 10
Product Ordering Codes
Temperature Grade Offerings
Note: *Most devices in the SmartFusion cSoC family can be ordered with the Y suffix. Devices with a package size greater or equal to
5x5 mm are supported. Contact your local Microsemi SoC Products Group sales representative for more information.
SmartFusion cSoC A2F060 A2F200 A2F500
TQ144 C, I – –
PQ208 – C, I C, I
CS288 C, I C, I C, I
FG256 C, I C, I C, I
FG484 – C, I C, I
Notes:
1. C = Commercial Temperature Range: 0°C to 85°C Junction
2. I = Industrial Temperature Range: –40°C to 100°C Junction
A2F200
FG
_
Part Number
SmartFusion Devices
Speed Grade
–1 = 100 MHz MSS Speed; FPGA Fabric 15% Faster than Standard
= 80 MHz MSS Speed; FPGA Fabric at Standard Speed
CPU Type
M3
M3 = Cortex-M3
Package Type
484
IG
Package Lead Count
256
208
288
484
Application (junction temperature range)
Y
Security Feature*
Y = Device Includes License to Implement IP Based on the
Cryptography Research, Inc. (CRI) Patent Portfolio
Blank = Commercial (0 to +85°C)
I = Industrial (–40 to +100°C)
ES = Engineering Silicon (room temperature only)
200,000 System Gates
A2F200 =
60,000 System Gates
A2F060 =
500,000 System Gates
A2F500 =
PQ
=
Plastic Quad Flat Pack (0.5 mm pitch)
TQ
=
Thin Quad Flat Pack (0.5 mm pitch)
FG
=
Fine Pitch Ball Grid Array (1.0 mm pitch)
CS
=
Chip Scale Package (0.5 mm pitch)
F
eNVM Size
A
=
8 Kbytes
B
=
16 Kbytes
C
=
32 Kbytes
D
=
64 Kbytes
E
=
128 Kbytes
F
=
256 Kbytes
G
=
512 Kbytes
Lead-Free Packaging Options
G = RoHS-Compliant (green) Packaging
Blank = Standard Packaging
1
Blank
Currently only the following eNVM sizes are available
per device:
A2F500M3 – G
A2F200M3 – F
A2F060M3 – E
Blank = Device Does Not Include License to Implement IP Based
on the Cryptography Research, Inc. (CRI) Patent Portfolio