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A2F060M3C-CS256YES

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型号: A2F060M3C-CS256YES
PDF文件:
  • A2F060M3C-CS256YES PDF文件
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功能描述: SmartFusion Customizable System-on-Chip (cSoC)
PDF文件大小: 11779.94 Kbytes
PDF页数: 共192页
制造商: MICROSEMI[Microsemi Corporation]
制造商LOGO: MICROSEMI[Microsemi Corporation] LOGO
制造商网址: http://www.microsemi.com
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120%
Datasheet Information
6-2 Revision 10
Revision 10
(continued)
A note was added to the "Supply Pins" table, referring to the SmartFusion cSoC
Board Design Guidelines application note for details on VCCPLLx capacitor
recommendations (SAR 42183).
5-1
In the "Supply Pins" section, the VPP capacitor value section has been modified to:
"For proper programming, 0.01μF, and 0.1μF to 1μF capacitors, (both rated at 16 V)
are to be connected in parallel across VPP and GND, and positioned as close to the
FPGA pins as possible." (SAR 43569).
5-1
In the "User Pins" section, added description ’These pins are located in Bank-2
(GPIO_16 to GPIO_31) for A2F060, A2F200, and A2F500 devices.’ for GPIO_x (SAR
28595).
5-6
Updated the MAINXIN and MAINXOUT pin descriptions in the "Special Function Pins"
section to read "If an external RC network or clock input is used, the RC components
are connected to the MAINXIN pin, with MAINXOUT left floating. When the main
crystal oscillator is not being used, MAINXIN and MAINXOUT pins can be left
floating." (SAR 42807).
5-8
Live at Power-Up (LAPU) has been replaced with ’Instant On’. NA
Revision 9
(September 2012)
The number of signal conditioning blocks (SCBs) for A2F500 in the "SmartFusion
cSoC Family Product Table" was corrected to 4. Previously it had incorrectly been
listed as 2 (SAR 39536).
II
The "Product Ordering Codes" section was revised to clarify that only one eNVM size
for each device is currently available (SAR 40333).
VI
Information pertaining to analog I/Os was added to the "Specifying I/O States During
Programming" section on page 1-3 (SAR 34836).
1-3
The formulas in the table notes for Table 2-29 • I/O Weak Pull-Up/Pull-Down
Resistances were corrected (SAR 34757).
2-27
Maximum values for VIL and VIH were corrected in LVPECL Table 2-66 • Minimum
and Maximum DC Input and Output Levels (SAR 37695).
2-43
Minimum pulse width High and Low values were added to the tables in the "Global
Tree Timing Characteristics" section. The maximum frequency for global clock
parameter was removed from these tables because a frequency on the global is only
an indication of what the global network can do. There are other limiters such as the
SRAM, I/Os, and PLL. SmartTime software should be used to determine the design
frequency (SAR 29270).
2-59
The temperature range for accuracy in Table 2-83 • Electrical Characteristics of the
RC Oscillator was changed from "0°C to 85°C" to "–40°C to 100°C" (SAR 33670). The
units for jitter were changed from ps to ps RMS (SAR 34270).
2-61
In Table 2-84 • Electrical Characteristics of the Main Crystal Oscillator, the output jitter
for the 10 MHz crystal was corrected from 50 ps RMS to 1 ns RS (SAR 32939).
Values for the startup time of VILXTAL were added (SAR 25248).
2-62
In Table 2-85 • Electrical Characteristics of the Low Power Oscillator, output jitter was
changed from 50 ps RMS to 30 ps RMS (SAR 32939). A value for ISTBXTAL standby
current was added (SAR 25249). Startup time for a test load of 30 pF was added
(SAR 27436).
2-62
Revision Changes Page
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