Continuous-Time Switch Family
A1 101, A1102, A1 103,
A1104, and A1106
5
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Characteristic Symbol Test Conditions Value Units
Package Thermal Resistance
R
θJA
Package LH, 1-layer PCB with copper limited to solder pads 228 ºC/W
Package LH, 2-layer PCB with 0.463 in.
2
of copper area each
side connected by thermal vias
110 ºC/W
Package UA, 1-layer PCB with copper limited to solder pads 165 ºC/W
6
7
8
9
2
3
4
5
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
20 40 60 80 100 120 140 160 180
Maximum Allowable V
CC
(V)
T
J(max)
= 165ºC; I
CC
= I
CC(max)
Power Derating Curve
(R
QJA
= 228 ºC/W)
Package LH, 1-layer PCB
(R
QJA
= 110 ºC/W)
Package LH, 2-layer PCB
(R
QJA
= 165 ºC/W)
Package UA, 1-layer PCB
V
CC(min)
V
CC(max)
0
100
200
300
400
500
600
700
800
900
1000
1100
1200
1300
1400
1500
1600
1700
1800
1900
20 40 60 80 100 120 140 160 180
Temperature (°C)
Power Dissipation, P
D
(mW)
Power Dissipation versus Ambient Temperature
(R
QJA
= 165 º
C/W
)
Package UA, 1-la
yer PCB
(R
QJA
= 228 ºC/W)
Packag
e LH, 1-layer PCB
(R
QJA
= 110 ºC/W)
Package LH, 2-layer PC
B
