49
Electrical characteristics
Type Technology Size
Power
P70
Operating Temp.
range
Max.
working voltage
Tolerance Resistance range
Min.
T. C. R.
PR Metal Plate
1206
1/4W
-55°C to 170°C (PxR)^1/2
±1%, ±2%, ±5%
1mΩ≤R≤6mΩ
±50ppm/°C
1/2W
1W
2010
1/2W
±1%, ±2%, ±5%
1mΩ≤R<100mΩ
1W
2512
1W
±0.5%
7mΩ≤R≤75mΩ
±1%, ±2%, ±5%
0.5mΩ≤R≤2mΩ ±200ppm/°C
3mΩ≤R≤5mΩ ±100ppm/°C
2W
±0.5%
7mΩ≤R≤75mΩ ±50ppm/°C
±1%, ±2%, ±5%
0.5mΩ≤R≤2mΩ ±200ppm/°C
3mΩ≤R≤5mΩ ±100ppm/°C
3W ±1%, ±2%, ±5% 0.5mΩ≤R≤10mΩ ±50ppm/°C
PA Metal Plate 2512
1W
-55°C to 155°C (PxR)^1/2 ±1%, ±5% 1mΩ≤R≤10mΩ ±100ppm/°C
2W
3W
Note: Pleasecontactwithsalesofces,distributorsandrepresentativesinyourregionbeforeordering
Environmental characteristics
Performance test Test method Procedure Requirements
Life
MIL-STD-202G-
method 108A
1 000 hours at 70 ±5°C applied RCWV
1.5 hours on, 0.5 hours off, still air required
±(1%+0.0005Ω)
High temperature exposure
MIL-STD-202G-
method 108A
1 000 hours at maximum operating temperature depending on
specication,unpowered
±(1%+0.0005Ω)
Moisture resistance
MIL-STD-202G-
method 106F
Eachtemperature/humiditycycleisdenedas8hours(method
106F),3cycles/24hoursfor10dwith25°C/65°C95%R.H
±(0.5%+0.0005Ω)
Thermal shock
MIL-STD-202G-
method 107G
LCT/UCT,numberofcyclesrequiredis300
Maximum transfer time is 20 seconds
±(0.5%+0.0005Ω)
Solder-
ability
Wetting
J-STD-002B
testB
Electricaltestnotrequired.Magnication50X
Lead-free solder bath at 245 ±3°C
Dipping time: 3 ±0.5 seconds
Well tinned
(≥95%covered)
Resistance to
soldering heat
MIL-STD-202G-
method 210F
Lead-free solder, 260°C, 10 seconds immersion time
±(0.5%+0.0005Ω)
No visible damage
Short time overload
MIL-R-55342D-
para 4.7.5
5 times of rated power for 5 seconds at room temperature
±(0.5%+0.0005Ω)
No visible damage
Chip Resistors Selection Charts
PR/PA/PF/PH/PE - Current sensors - low T. C. R. chip resistors, 0402 to 4527