57
Derating curve Construction
Maximum dissipation (P) in percentage of
rated power as a function of the operating
ambient temperature (T
amb
).
100
80
60
40
20
-55-40 -20020 40 60 80
70
100120 140 160
Ambient Temperature (
C)
155
overcoat
protective glass
resistive layer
(jumper chip is a conductor)
inner electrode
termination (Ni / Au / Pd)
ceramic substrate
marking layer
Dimensions
W
unit: m
I
2
I
2
I
1
I
1
L
H
Type L W H I
1
I
2
AR0402 1.00 ±0.05 0.50 ±0.05 0.35 ±0.05 0.20 ±0.10 0.25 ±0.10
AR0603 1.60 ±0.10 0.80 ±0.10 0.45 ±0.10 0.25 ±0.15 0.25 ±0.15
AR0805 2.00 ±0.10 1.25 ±0.10 0.50 ±0.10 0.35 ±0.20 0.35 ±0.20
AR1206 3.10 ±0.10 1.60 ±0.10 0.55 ±0.10 0.45 ±0.20 0.40 ±0.20
Features
• New NiAu terminations provide special application for
hybrid board gluing
• Competitive with AgPd terminations
• Special use in high temperature environment
• Higher component and equipment reliability
Chip Resistors Selection Charts
AR - NiAu termination chip resistors, 0402 to 1206