Conditions:
Oven:
Soldering profile:
Highest Temperature:
PCB
PCB Surface:
Solder Paste:
Stencil thickness:
Vias:
Spokes:
Solano RO 500
IPC/JEDEC J-STD-020D
305 ˚C
1,55mm thick, double Layer FP-4
35µ Cu, NiAu-finish
Keatin: Alloy Sn96,5AG3CU0,5/Metall 88%
150 μm
None
9771xxx360 – 2-spoke stencil
9774xxx360/9774xxx151/9774xxx234 – 4-spoke stencil
Our Requirements for
SMD Steel Spacer
Five Time Reflow Test
• J-STD-020D
Solderability
• JESD22-B102
Thermal Shock
• MIL-STD-202, Method 107
• Temperature -55°C to 155°C
• Dwell time 30 minutes
• Cycles: 500
• Transfer time max. 20s
Vibration Test
• MIL-STD-202, Method 204
• 10g´s for 20minutes
• 12 cycles each of 3 orientations
• 15-2000Hz
Moisture Resistance
• MIL-STD-202, Method 106
• Temperature: 65°C
• Humidity: 95%
• Duration: 500h
RoHS & REACh Compliant
