93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
DS21796D-page 18 2004 Microchip Technology Inc.
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
10501050
β
Mold Draft Angle Bottom
10501050
α
Mold Draft Angle Top
0.300.250.19.012.010.007BLead Width
0.200.150.09.008.006.004
c
Lead Thickness
0.700.600.50.028.024.020LFoot Length
3.103.002.90.122.118.1 14DMolded Package Length
4.504.404.30.177.173.169E1Molded Packag e Width
6.506.386.25.256.251.246EOverall Width
0.150.100.05.006.004.002
A1
Standoff §
0.950.900.85.037.035.033A2Mold ed Packag e Thick ness
1.10.043AOverall Height
0.65.026
p
Pitch
88
n
Number of Pins
MAXNOMMINMAXNOMMINDimensi on Li mits
MILLIMETERS*INCHESUnits
α
A2
A
A1
L
c
β
φ
1
2
D
n
p
B
E
E1
Foot A ngle
φ
048048
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-086
§ Significant Characteristic
