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66AK2L06

66AK2L06首页预览图
型号: 66AK2L06
PDF文件:
  • 66AK2L06 PDF文件
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功能描述: 66AK2L06 Multicore DSPARM KeyStone II System-on-Chip (SoC)
PDF文件大小: 1516.59 Kbytes
PDF页数: 共298页
制造商: TI[Texas Instruments]
制造商LOGO: TI[Texas Instruments] LOGO
制造商网址: http://www.ti.com
捡单宝66AK2L06
PDF页面索引
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120%
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2015
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
66AK2L06XCMS ACTIVE FCBGA CMS 900 44 Green (RoHS
& no Sb/Br)
SNAGCU Level-4-245C-72HR 0 to 100 66AK2L06XCMS
@2013
1GHZ
66AK2L06XCMS2 ACTIVE FCBGA CMS 900 44 Green (RoHS
& no Sb/Br)
SNAGCU Level-4-245C-72HR 0 to 100 66AK2L06XCMS
@2013
66AK2L06XCMSA ACTIVE FCBGA CMS 900 44 Green (RoHS
& no Sb/Br)
SNAGCU Level-4-245C-72HR -40 to 100 66AK2L06XCMS
@2013
A1GHZ
66AK2L06XCMSA2 ACTIVE FCBGA CMS 900 44 Green (RoHS
& no Sb/Br)
SNAGCU Level-4-245C-72HR -40 to 100 66AK2L06XCMS
@2013
A1.2GHZ
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
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