• 当前位置:
  • 首页
  • >
  • PDF资料
  • >
  • 66AK2L06 PDF文件及第161页内容在线浏览

66AK2L06

66AK2L06首页预览图
型号: 66AK2L06
PDF文件:
  • 66AK2L06 PDF文件
  • 66AK2L06 PDF在线浏览
功能描述: 66AK2L06 Multicore DSPARM KeyStone II System-on-Chip (SoC)
PDF文件大小: 1516.59 Kbytes
PDF页数: 共298页
制造商: TI[Texas Instruments]
制造商LOGO: TI[Texas Instruments] LOGO
制造商网址: http://www.ti.com
捡单宝66AK2L06
PDF页面索引
[1] 页[2] 页[3] 页[4] 页[5] 页[6] 页[7] 页[8] 页[9] 页[10] 页[11] 页[12] 页[13] 页[14] 页[15] 页[16] 页[17] 页[18] 页[19] 页[20] 页[21] 页[22] 页[23] 页[24] 页[25] 页[26] 页[27] 页[28] 页[29] 页[30] 页[31] 页[32] 页[33] 页[34] 页[35] 页[36] 页[37] 页[38] 页[39] 页[40] 页[41] 页[42] 页[43] 页[44] 页[45] 页[46] 页[47] 页[48] 页[49] 页[50] 页[51] 页[52] 页[53] 页[54] 页[55] 页[56] 页[57] 页[58] 页[59] 页[60] 页[61] 页[62] 页[63] 页[64] 页[65] 页[66] 页[67] 页[68] 页[69] 页[70] 页[71] 页[72] 页[73] 页[74] 页[75] 页[76] 页[77] 页[78] 页[79] 页[80] 页[81] 页[82] 页[83] 页[84] 页[85] 页[86] 页[87] 页[88] 页[89] 页[90] 页[91] 页[92] 页[93] 页[94] 页[95] 页[96] 页[97] 页[98] 页[99] 页[100] 页[101] 页[102] 页[103] 页[104] 页[105] 页[106] 页[107] 页[108] 页[109] 页[110] 页[111] 页[112] 页[113] 页[114] 页[115] 页[116] 页[117] 页[118] 页[119] 页[120] 页[121] 页[122] 页[123] 页[124] 页[125] 页[126] 页[127] 页[128] 页[129] 页[130] 页[131] 页[132] 页[133] 页[134] 页[135] 页[136] 页[137] 页[138] 页[139] 页[140] 页[141] 页[142] 页[143] 页[144] 页[145] 页[146] 页[147] 页[148] 页[149] 页[150] 页[151] 页[152] 页[153] 页[154] 页[155] 页[156] 页[157] 页[158] 页[159] 页[160] 页[161] 页[162] 页[163] 页[164] 页[165] 页[166] 页[167] 页[168] 页[169] 页[170] 页[171] 页[172] 页[173] 页[174] 页[175] 页[176] 页[177] 页[178] 页[179] 页[180] 页[181] 页[182] 页[183] 页[184] 页[185] 页[186] 页[187] 页[188] 页[189] 页[190] 页[191] 页[192] 页[193] 页[194] 页[195] 页[196] 页[197] 页[198] 页[199] 页[200] 页[201] 页[202] 页[203] 页[204] 页[205] 页[206] 页[207] 页[208] 页[209] 页[210] 页[211] 页[212] 页[213] 页[214] 页[215] 页[216] 页[217] 页[218] 页[219] 页[220] 页[221] 页[222] 页[223] 页[224] 页[225] 页[226] 页[227] 页[228] 页[229] 页[230] 页[231] 页[232] 页[233] 页[234] 页[235] 页[236] 页[237] 页[238] 页[239] 页[240] 页[241] 页[242] 页[243] 页[244] 页[245] 页[246] 页[247] 页[248] 页[249] 页[250] 页[251] 页[252] 页[253] 页[254] 页[255] 页[256] 页[257] 页[258] 页[259] 页[260] 页[261] 页[262] 页[263] 页[264] 页[265] 页[266] 页[267] 页[268] 页[269] 页[270] 页[271] 页[272] 页[273] 页[274] 页[275] 页[276] 页[277] 页[278] 页[279] 页[280] 页[281] 页[282] 页[283] 页[284] 页[285] 页[286] 页[287] 页[288] 页[289] 页[290] 页[291] 页[292] 页[293] 页[294] 页[295] 页[296] 页[297] 页[298] 页
120%
66AK2L06
www.ti.com
SPRS930 APRIL 2015
Table 9-6. I
2
C Master Mode Device Configuration Field Descriptions (continued)
Bit Field Description
10-9 Bus Addr I
2
C bus address slave device
0 = I
2
C slave boot bus address is 0x50 (default)
1 = I
2
C slave boot bus address is 0x51
2 = I
2
C slave boot bus address is 0x52
3 = I
2
C slave boot bus address is 0x53
8 Boot Master Boot Master select
0 = ARM is boot master
1 = C66x is boot master
7 Reserved Reserved
6-5 Port I
2
C port number
0 = I
2
C0 (default)
1 = I
2
C1
2 = I
2
C2
3 = Reserved
4 Min Minimum boot configuration select bit.
0 = Minimum boot pin select disabled
1 = Minimum boot pin select enabled.
When Min = 1, a predetermined set of values is configured (see the Device Configuration Field Descriptions table
for configuration bits with a "(default)" tag added in the description column).
When Min = 0, all fields must be independently configured.
3-1 Boot Devices Boot Devices[3:1]
010 = I
2
C Master
Others = Other boot modes
0 Lendian Endianess
0 = Big endian
1 = Little endian
9.1.2.2.3 SPI Boot Device Configuration
Figure 9-5. SPI Device Configuration Fields
DEVSTAT Boot Mode Pins ROM Mapping
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Width1 Mode Param ldx/Offset Csel Boot Master Width0 Port Min 011 Lendian
Table 9-7. SPI Device Configuration Field Descriptions
Bit Field Description
16-7 Width1:Width0 SPI address width configuration
00 = 16-bit address values are used
01 = 24-bit address values are used (default)
01 = 32-bit address values are used
11 = 32-bit address values are used
15-14 Mode Clk Polarity/ Phase
0 = Data is output on the rising edge of SPICLK. Input data is latched on the falling edge.
1 = Data is output one half-cycle before the first rising edge of SPICLK and on subsequent falling
edges. Input data is latched on the rising edge of SPICLK.
2 = Data is output on the falling edge of SPICLK. Input data is latched on the rising edge (default).
3 = Data is output one half-cycle before the first falling edge of SPICLK and on subsequent rising
edges. Input data is latched on the falling edge of SPICLK.
13-11 Param Idx/Offset Parameter Table Index: 0-7
This value specifies the parameter table index when the C66x is the boot master
This value specifies the start read address at 8K times this value when the ARM is the boot master
Copyright © 2015, Texas Instruments Incorporated Device Boot and Configuration 161
Submit Documentation Feedback
Product Folder Links: 66AK2L06
购买、咨询产品请填写询价信息:(3分钟左右您将得到回复)
询价型号*数量*批号封装品牌其它要求
删除
删除
删除
删除
删除
增加行数
  •  公司名:
  • *联系人:
  • *邮箱:
  • *电话:
  •  QQ:
  •  微信:

  • 关注官方微信

  • 联系我们
  • 电话:13714778017
  • 周一至周六:9:00-:18:00
  • 在线客服:

天天IC网由深圳市四方好讯科技有限公司独家运营

天天IC网 ( www.ttic.cc ) 版权所有©2014-2023 粤ICP备15059004号

因腾讯功能限制,可能无法唤起QQ临时会话,(点此复制QQ,添加好友),建议您使用TT在线询价。

继续唤起QQ 打开TT询价