66AK2E05, 66AK2E02
SPRS865D –NOVEMBER 2012–REVISED MARCH 2015
www.ti.com
3 Device Characteristics
Table 3-1 provides an overview of the 66AK2E0x device. The table shows the significant features of the
device, including the capacity of on-chip RAM, the peripherals, the CPU frequency, and the package type
with pin count.
Table 3-1. Characteristics of the 66AK2E0x Processor
HARDWARE FEATURES 66AK2E02 66AK2E05
C66x DSP core 1
DSP L1P cache memory size (per core) 32KB
DSP Cores
DSP L1D cache/RAM memory size (per core) 32KB
DSP L2 Unified cache/RAM memory size (per core) 512KB
ARM Cortex A15 Cores 1 4
ARM L1 instruction cache memory size (per core) 32KB
ARM Cores
ARM L1 data cache memory size (per core) 32KB
ARM L2 unified cache memory size (shared by all cores) 4MB
DDR3 memory controller (72-bit bus width) [1.5 V/1.35V] (clock source = 1
DDRREFCLKN|P)
EDMA3 (64 independent channels) [CPU/3 clock rate] 5
Hyperlink 1
USB 3.0 2
USIM
(1)
1
I
2
C 3
SPI 3
Peripherals
PCIe (2 lanes per instance) 2
UART 2
10/100/1000/10000 Ethernet ports 0 2
10/100/1000 Ethernet ports 8 8
Management Data Input/Output (MDIO) 3
64-bit timers (configurable) Thirteen 64-bit or Twenty six 32-bit
General-Purpose Input/Output port (GPIO) 32
TSIP 1
Packet Accelerator 1
Accelerators
Security Accelerator
(2)
1
2MB MSM SRAM
On-Chip L3 Memory Organization
256 KB L3 ROM
C66x CorePac Revision CorePac Revision ID Register (address location: 0181 2000h) 0x0009_0003
ID
JTAG BSDL_ID JTAGID Register (address location: 0x02620018) 0x0B9A_602F
1.25 GHz
Frequency C66x DSP and ARM-A15 Processor
1.4 GHz
Core (V) SmartReflex variable supply
Voltage
I/O (V) 1.35 V, 1.5 V, 1.8 V, and 3.3 V
27 mm x 27 mm 1089-Pin Flip-Chip Plastic BGA
BGA Package
(ABD)
Process Technology nm 28 nm
Product Status
(3)
Product Preview (PP), Advance Information (AI), or Production Data (PD) PD
(1) The USIM is implemented for support of secure devices only. Contact your local technical sales representative for further details.
(2) The Security Accelerator function is subject to export control and will be enabled only for approved device shipments.
(3) PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
8 Device Characteristics Copyright © 2012–2015, Texas Instruments Incorporated
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