66A K2
ABD
PREFIX
X = Experimental device
Blank = Qualified device
DEVICE FAMILY
66A = DSP + ARM SoC
( _ )
E
ARCHITECTURE
K2 = KeyStone II
05
Blank = Initial 1.0 silicon
SILICON REVISION
DEVICE NUMBER
05
( _ ) ( _ ) ( _ )( _ )
PLATFORM
E
PACKAGE TYPE
ABD = 1089-pin plastic ball grid array,
with Pb-free solder balls and die bumps
MAXIMUM DEVICE SPEED
25 = 1.25 GHz
TEMPERATURE RANGE
A = Extended temperature range (-40°C to +100°C)
Blank = 0°C to +85°C)Commercial temperature range (
4 = 1.4 GHz
SECURITY
Blank = Security Accelerator disabled / General Purpose device
X = Security Accelerator enabled / General Purpose device
D = Security Accelerator enabled / High Security device
with TI developmental keys
S = Security Accelerator enabled / High Security device
with production keys
66A K2
ABD
PREFIX
X = Experimental device
Blank = Qualified device
DEVICE FAMILY
66A = DSP + ARM SoC
( _ )
E
ARCHITECTURE
K2 = KeyStone II
02
Blank = Initial 1.0 silicon
SILICON REVISION
DEVICE NUMBER
02
( _ ) ( _ ) ( _ )( _ )
PLATFORM
E
PACKAGE TYPE
ABD = 1089-pin plastic ball grid array,
with Pb-free solder balls and die bumps
MAXIMUM DEVICE SPEED
25 = 1.25 GHz
TEMPERATURE RANGE
A = Extended temperature range (-40°C to +100°C)
Blank = 0°C to +85°C)Commercial temperature range (
4 = 1.4 GHz
SECURITY
Blank = Security Accelerator disabled / General Purpose device
X = Security Accelerator enabled / General Purpose device
D = Security Accelerator enabled / High Security device
with TI developmental keys
S = Security Accelerator enabled / High Security device
with production keys
66AK2E05, 66AK2E02
www.ti.com
SPRS865D –NOVEMBER 2012–REVISED MARCH 2015
3.4.2 Part Number Legend
The following figures provide a legend for reading the complete device name for a KeyStone II device.
Figure 3-1. Device Nomenclature for 66AK2E02
Figure 3-2. Device Nomenclature for 66AK2E05
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