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6236BG

6236BG首页预览图
型号: 6236BG
PDF文件:
  • 6236BG PDF文件
  • 6236BG PDF在线浏览
功能描述: Channel style heat sink with folded back fins
PDF文件大小: 8734.67 Kbytes
PDF页数: 共116页
制造商: AAVID[Aavid Thermalloy, LLC]
制造商LOGO: AAVID[Aavid Thermalloy, LLC] LOGO
制造商网址: http://www.aavidthermalloy.com
捡单宝6236BG
PDF页面索引
120%
9
HOW TO SELECT A HEAT SINK
EUROPE
ASIA
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Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
The basic equation for heat transfer or power dissipation may be stated as follows:
Where:
P
D =
the power dissipated by the semiconductor device in watts.
ΔT = the temperature difference of driving potential which causes the flow of heat.
ΣR
θ
= the sum of the thermal resistances of the heat flow path across which ΔT exists.
The above relationship may be stated in the following forms:
The above equations are generally used to determine the required thermal resistance of the heat sink (R
θSA
),
since the heat dissipation, maximum junction and/or case temperature, and ambient temperature are known or set.
How To Select a Heat Sink
Where:
T
J
= the junction temperature in °C (maximum is usually stated by the manufacturer of the semiconductor device).
T
C
= case temperature of the semiconductor device in °C.
T
S
= temperature of the heat sink mounting surface in thermal contact with the semiconductor device in °C.
T
A
= ambient air temperature in °C.
R
θJC
= thermal resistance from junction to case of the semiconductor device in °C per watt
(usually stated by manufacturer of semiconductor device).
R
θCS
= thermal resistance through the interface between the semiconductor device
and the surface on which it is mounted in °C per watt.
R
θSA
= thermal resistance from mounting surface to ambient or thermal resistance of heat sink in °C per watt.
Figure 1 indicates the location of the various heat
flow paths, temperatures and thermal resistances.
The common practice is to represent the system with
a network of resistances in series as shown in Figure 2.
Atmosphere
or ambient
Mounting surface
(cooler/dissipator)
Semiconductor case
Junction
(heat source)
Interface
Heat flow path mounting
surface to ambient, equation (3)
Heat flow path case
to ambient equation (2)
Heat flow path junction
to ambient, equation (1)
P
D
P
D
T
A
R
θSA
R
θCS
R
θJC
T
S
T
C
T
A
T
J
T
J
–T
A
P
D
=
R
θJC +
R
θCS +
R
θSA
T
C
–T
A
P
D
=
R
θCS +
R
θSA
T
S
–T
A
P
D
=
R
θSA
Δ T
P
D
=
ΣR
θ
R
θCS
R
θJC
T
S
T
A
T
J
R
θSA
T
C
FIGURE 1
FIGURE 2
How to select a heat sink
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