87
INTERFACE MATERIALS
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886 (2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Alignment Pads
Aavid Thermalloy has added a phase change
pad to its line-up.These pads provide low
thermal resistance and electrical isolation
for low pressure spring mount applications.
Above the phase change temperature the
material flows to fill in surface irregularities
and maximize the heat conduction path.
Interface Material/Pads
Solderable alignment pads are an innovative
way to attach the heat sink to your transistor that
could cut your assembly time by more than half.
Alignment pads provide cost effective solderability,
while providing numerous additional benefits.
Alignment pads are factory applied and can be
bought separately as well. Please refer to accessory
Index D on page 85.
Suffix Device Figure
8223-CL03G TO-220 B
8241-CL11G TO-218 A
Hi-Flow®*
C
Reinforcement carrier Polymide
Thickness 0.127 (0.005)
Continuous use temp (°C) 150
Phase change temp(°C) 55
Dielectric breakdown voltage (Vac) 5000
Dielectric constant (1000 Hz) 4.5
Volume resistivity (Ohm-meter) 1012
MATERIAL PROPERTIES
TO-3
TO-220
TO-218
530101B _ 5150G
Ordering code
ORDERING INFORMATION
example 12 digit part
Ordering code Description
0 No pads
7 One Hi-Flow® pad
8 Two Hi-Flow® pads
The shape and hole pattern of the heat sink will determine the shape and hole
pattern of the pad. If you are ordering a heat sink which mounts to a semicon-
ductor on both sides, the ordering code for two pads should be used.To order
additional Hi-Flow® pads separate, or factory applied variations please contact
an Aavid sales rep for inquiries.
Thermal impedance vs. pressure
Pressure 10 25 50 200
TO-220 Thermal performance (ºC/W) 1.15 1.14 1.12 1.1
* Hi-Flow® is a registered trademark of the Bergquist Company
