75
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
6.35
(0.250)
10.03
(0.395)
21.08
(0.830)
8.03
(0.316)
ø
"A"
Part Number “A”Dim
578105B00000G 3.96 (0.156)
578205B00000G 6.35 (0.250)
578305B00000G 12.70 (0.500)
578405B00000G 19.05 (0.750)
578505B00000G 25.40 (1.000)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
50
0
20
40
60
80
100
0.0 0.4 0.8 1.2 1.6 2.0
40
30
10
20
0
0
400
200 600 800
1000
578205
578105
Mounting Surface Temp
Rise Above Ambient—°C
Snap on cooler features easy
no tools installation. Folded
back fins provide maximum
surface area while preserving
valuable board space.
5781, 5782, 5783, 5784, 5785 Snap on cooler heat sink
6201, 6202, 6203 Space saving expandable heat sink
Space saving expandable heat sink
features a collar that tightly grips the
device meaning no extra hardware is
required. Heat sinks are constructed of
pre-black anodize material to lower cost.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
50
0
20
40
60
80
100
0.0 0.4 0.8 1.2 1.6 2.0
40
30
10
20
0
0
400
200 600 800
1000
6202
6201
Mounting Surface Temp
Rise Above Ambient—°C
6203
32.51
(1.280)
6.35
(0.250)
ø
8.03
(0.316)
I.D.
"A"
Part Number “A”Dim # Fins
6201PBG 6.35 (0.250) 1
6202PBG 12.70 (0.500) 2
6203PBG 19.56 (0.770) 3
ORDERING INFORMATION
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
Material: 0.63 (0.025) Thick Aluminum
Finish: Pre Black Anodize*
TO-05 Heat Sinks
* Edges cut during the manufacturing process will be unfinished.
See page 110 more more information
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
50
0
20
40
60
80
100
0.0 0.4 0.8 1.2 1.6 2.0
40
30
10
20
0
0
400
200 600 800
1000
578405
Mounting Surface Temp
Rise Above Ambient—°C
578305
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
50
0
20
40
60
80
100
0.0 0.4 0.8 1.2 1.6 2.0
40
30
10
20
0
0
400
200 600 800
1000
Mounting Surface Temp
Rise Above Ambient—°C
578505
5F Low cost push on heat sink
12.70
(0.500)
16.00
(0.630)
7.90
(0.311)
ø
ø
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
50
0
20
40
60
80
100
0 0.5 1 1.5 2 2.5
40
30
10
20
0
0
400
200 600 800
1000
Mounting Surface Temp
Rise Above Ambient —°C
Part Number Description
5FG Low cost push on heat sink
ORDERING INFORMATION
Material: Aluminum
Finish: Black Anodize
Low cost push on heat sink
uses spring pressure to firmly
grip the device case creating
a good thermal interface.