60
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
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AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
6396, 6398, 6399, 6400 High power extruded heat sink with large radial fins
High power extruded heat sink
with large radial fins and solder-
able shoulder pins allows vertical
mounting without stress on the
device leads. Available with shoul-
der pins to provide fixed clearance
between the bottom of the heat
sink and the board. Available in
four heights for TO-220, TO-218,
TO-247and multiwatt devices.
1.57
(0.062)
25.40
(1.000)
41.91
(1.650)
19.05
(0.750)
2.41
(0.095)
1.27
(0.050)
2.46
(0.097)
5.49
(0.216)
"A"
3.81
(0.150)
REF
REF
25.40
(1.000)
0.78
(0.031)
ø
SEE DETAIL A
P2 MODEL ONLY
DETAIL A
P2 MODEL ONLY
3.96
(0.156)
2.21
(0.087)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
048 121620
4
3
1
2
0
0
400
200 600 800
1000
6398
6396
Mounting Surface Temp
Rise Above Ambient—°C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Description “A” Dim
6396BG Extruded heat sink with large radial fins and straight pins 25.40 (1.000) 2.89 (0.114)
6396B-P2G With solderable shoulder pins 25.40 (1.000) 3.10 (0.122)
6398BG Extruded heat sink with large radial fins and straight pins 38.10 (1.500) 2.89 (0.114)
6398B-P2G With solderable shoulder pins 38.10 (1.500) 3.10 (0.122)
6399BG Extruded heat sink with large radial fins and straight pins 50.80 (2.000) 2.89 (0.114)
6399B-P2G With solderable shoulder pins 50.80 (2.000) 3.10 (0.122)
6400BG Extruded heat sink with large radial fins and straight pins 63.50 (2.500) 2.89 (0.114)
6400B-P2G With solderable shoulder pins 63.50 (2.500) 3.10 (0.122)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
048 121620
4
3
1
2
0
0
400
200 600 800
1000
6400
6399
Mounting Surface Temp
Rise Above Ambient—°C
Dia of PCB
Plated Thru
Hole for Pins
6380, 6381, 6382 High power extruded heat sink
High power extruded heat sink
for SIP packages. Solderable pins
allow vertical mounting without
stress on the device leads. Available
in three heights. Can also be used
for dual TO-220, TO-218,TO-247
and multiwatt devices.
18.29
(0.720)
3.96
(0.156)
19.86
(0.782)
9.93
(0.391)
3.81
(0.150)
33.05
(1.301)
31.74
(1.250)
25.40
(1.000)
28.70
(1.130)
41.91
(1.650)
2.64
(0.104)
11.91
(0.469)
1.58
(0.062)
ø
"A"
2.21
(0.087)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
0 4 8 12 16 20
4
3
1
2
0
0
400
200 600 800
1000
Mounting Surface Temp
Rise Above Ambient—°C
6381
6382
6380
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Description “A”Dim
6380BG Extruded heat sink with solderable pins 25.40 (1.000) 2.89 (0.114)
6381BG Extruded heat sink with solderable pins 38.10 (1.500) 2.89 (0.114)
6382BG Extruded heat sink with solderable pins 50.80 (2.000) 2.89 (0.114)
Dia of PCB
Plated Thru
Hole for Pins
TO-220 & TO-218 & TO-247 & Multiwatt Heat Sinks
For additional options see page 85
For additional options see page 85