50
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
TO-220 Heat Sinks
10.92
(0.430)
14.22
(0.560)
2.41
(0.095)
7.92
(0.312)
3.18
(0.125)
1.52
(0.060)
12.32
(0.485)
6.15
(0.242)
3.18
(0.125)
9.91
(0.390)
15.88
(0.625)
11.10
(0.437)
18.29
(0.720)
34.93
(1.375)
3.18
(0.125)
12.70
(0.500)
2.36
(0.093)
25.40
(1.000)
3.96
(0.156)
"A"
HIGH DITTIN
0.63
(0.025)
x
ø
SLOT TYP 2
1.78
(0.070)
10.19
(0.401)
x
ø
ø
2.34
(0.092)
2x
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0246810
8
6
2
4
0
0
400
200 600 800
1000
534002
533902
533802
Mounting Surface Temp
Rise Above Ambient—°C
Extruded heat sink with radial fins
and channel clip attach feature
make device attachment easy.
Includes clip and two solderable
mounting pins which permit vertical
mounting and eliminate stress on
device leads. Available in three
heights for TO-220 devices.
5338, 5339, 5340 Extruded heat sink with radial fins
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number “A” Dim
533802B02554G 25.40 (1.000) 2.67 (0.105)
533902B02554G 38.10 (1.500) 2.67 (0.105)
534002B02554G 50.80 (2.000) 2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
CLIP 54
19.05
(0.750)
25.40
(1.000)
2.54
(0.100)
11.68
(0.460)
41.91
(1.650)
2.36
(0.093)
THRU
3.66
(0.144)
20.96
(0.825)
3.96
(0.156)
"A"
25.40
(1.000)
12.70
(0.500)
ø
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
048121620
4
3
1
2
0
0
400
200 600 800
1000
532702
532802
532602
Mounting Surface Temp
Rise Above Ambient—°C
High power extruded heat sink
with large radial fins and
increased fin count for additional
cooling capacity. Solderable pins
allow vertical mounting without
stress on the device leads. Available
in three heights for TO-220 devices.
5326, 5327, 5328 High power extruded heat sink with large radial fins
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number “A” Dim
532602B02500G 38.10 (1.500) 2.67 (0.105)
532702B02500G 50.80 (2.000) 2.67 (0.105)
532802B02500G 63.50 (2.500) 2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
For additional options see page 83
2.00
(0.079)
2.15
(0.085)
15.00
(0.591)
20.00
(0.787)
3.15
(0.124)
THRU
6.00
(0.236)
10.30
(0.406)
25.00
(0.984)
19.50
(0.768)
7.49
(0.295)
ø
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
02 4 6 810
16
12
4
8
0
0
400
200 600 800
1000
Mounting Surface Temp
Rise Above Ambient—°C
Extruded channel style heat sink
features serrated fins for increased
cooling capacity. The base of the heat
sink is notched to clear the device
leads when mounted horizontally on
the printed circuit card. Narrow chan-
nel accommodates a TO-220 device.
ML26AA Extruded channel style heat sink featuring serrated fins
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Description
ML26AAG Extruded channel style heat sink
For additional options see page 83
