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THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
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Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
FIGURE A
SMT Footprints
Recommended copper heat speader drain pad footprint
Recommended heat sink solder mask opening
Note: The thickness of
the drain pad is variable
depending on the amount
of heat generated by the
SMT device, design limita-
tions and process.
Part Number “L” “W”
573100 9.53 (0.375) 13.97 (0.550)
573300 14.22 (0.560) 16.26 (0.640)
573400 14.22 (0.560) 21.08 (0.830)
Part Number “L” “W1” “W2”
573100 9.02 (0.355) 13.46 (0.530) 8.89 (0.350)
573300 13.72 (0.540) 15.75 (0.620) 11.18 (0.440)
573400 13.72 (0.540) 20.57 (0.810) 16.00 (0.630)
Recommended copper pad size
for heat sink and device mounting footprint
For D Pak (TO-263)
For MO-184 and SO-10
Recommended copper pad size
for heat sink and device mounting footprint