25
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
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7109 Surface mount heat sink for D
2
PAK (TO-263) package semiconductors
Surface mount heat sink for D
2
PAK
(TO-263) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks.The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
Surface mount heat sink for D
3
PAK
(TO-268) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks.The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
5734 Surface mount heat sink for D
3
PAK (TO-268) package semiconductors
Tape and Reel information
Part Number “A” Dim “B” Dim “C” Dim “D” Dim
7106D/TRG 44.00 (1.730) 40.40 (1.590) 24.00 (0.940) 4.06 (0.160)
7109D/TRG 44.00 (1.730) 40.40 (1.590) 36.00 (1.420) 4.06 (0.160)
573100D00010G 44.00 (1.730) 40.40 (1.590) 16.00 (0.630) 4.06 (0.160)
573300D00010G 44.00 (1.730) 40.40 (1.590) 24.00 (0.940) 4.06 (0.160)
573400D00010G 44.00 (1.730) 40.40 (1.590) 24.00 (0.940) 4.06 (0.160)
ORDERING INFORMATION
SMT
ORDERING INFORMATION
Part Number Packaging
7109D/TRG 13" Reel, 125 per reel
7109DG Bulk, 500 per bag
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
See below for tape and reel information
Refer to Figure D on page 26 for board footprint information
ORDERING INFORMATION
Part Number Packaging
573400D00010G 13" Reel, 250 per reel
573400D00000G Bulk, 500 per bag
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
See below for tape and reel information
Refer to Figure A and B on page 26 for board footprint information