23
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
5085, 5086, 5087 Extruded epoxy attach on heat sink with straight fins
Extruded epoxy attach on heat sink
with straight fins attaches to 24, 28,
and 40 pin DIP packages quickly and
easily. May be added before or after
final board assembly. No additional
board space is required.
13.46
(0.530)
4.83
(0.190)
"A"
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
01 2 34 5
16
12
4
8
0
0
400
200 600 800
1000
Mounting Surface Temp
Rise Above Ambient—°C
508600
508500
508700
ORDERING INFORMATION
Part Number DIP Package “A” Dim
508500B00000G 24 pin 31.75 (1.250)
508600B00000G 28 pin 36.83 (1.450)
508700B00000G 40 pin 50.80 (2.000)
Material: Aluminum
Finish: Black Anodize
6284 Extruded epoxy attach heat sink
Extruded epoxy attach heat sink
which requires no additional board
space is suitable for narrow DIP
packages. May be added before
or after final board assembly. No
additional board space is required.
Attaches to 28 pin DIP.
13.46
(0.530)
12.06
(0.475)
36.83
(1.450)
REF
REF
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
25
0
20
40
60
80
100
012 345
20
15
5
10
0
0
400
200 600 800
1000
Mounting Surface Temp
Rise Above Ambient—°C
ORDERING INFORMATION
Part Number Description
6284BG Extruded epoxy attach heat sink for 28 pin DIP
Material: Aluminum
Finish: Black Anodize
DIPS
5011, 5012 Extruded epoxy attach heat sink with straight fins
Extruded epoxy attach heat sink with
straight fins attaches to 14 and 16 pin
DIP packages quickly and easily. May be
added before or after final board assembly.
No additional board space is required.
Available in two fin directions.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
100
0
20
40
60
80
100
0.0 0.4 0.8 1.2 1.6 2.0
80
60
20
40
0
0
400
200 600 800
1000
Mounting Surface Temp
Rise Above Ambient—°C
501200
501100
5
01
1
–
50
1
2
19.05
(0.750)
REF
6.35
(0.250)
REF
4.82
(0.190)
ORDERING INFORMATION
Part Number Description Figure
501100B00000G Extruded epoxy attach heat sink with straight fins A
501200B00000G Extruded epoxy attach heat sink with straight fins B
Material: Aluminum
Finish: Black Anodize
4.83
(0.190)
18.57
(0.730)
6.35
(0.250)
FIGURE A
FIGURE B
For epoxy information see pages 114-115.
For epoxy information see pages 114-115.
For epoxy information see pages 114-115.
