16
HEAT SINKS FOR IC PACKAGES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
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Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Heat sinks for plastic BGA packages
IC Pkg. Size (mm) IC Pkg. Style Part Number “W” (mm) “L” (mm) “H” (mm)
θ
n
2
θ
f
3
Finish Tape code
1
10 x 10 Plastic 375324B00035G 10.20 10.20 10.20 71.40 21.20 Black anodize 35
15 x 15 Plastic 375424B00034G 15.20 15.20 6.40 62.50 17.60 Black anodize 34
23 x 23 Plastic 374024B00035G 23.00 23.00 10.00 40.00 11.69 Black anodize 35
23 x 23 Plastic 374124B00035G 23.00 23.00 18.00 23.40 7.39 Black anodize 35
23 x 23 Plastic 374224B00035G 23.00 23.00 25.00 19.70 6.370 Black anodize 35
25 x 25 Plastic 335224B00034G 25.00 25.00 9.90 34.00 10.39 Black anodize 34
27 x 27 Plastic 374324B00035G 27.00 27.00 10.00 30.60 9.35 Black anodize 35
27 x 27 Plastic 374424B00035G 27.00 27.00 18.00 20.30 6.46 Black anodize 35
27 x 27 Plastic 374524B00035G 27.00 27.00 25.00 16.50 5.47 Black anodize 35
28 x 28 Plastic 373024B00034G 27.90 27.90 8.90 33.30 10.00 Black anodize 34
28 x 28 Plastic 2327B-CP50G 27.90 28.10 15.20 23.40 7.43 Black anodize 34
31 x 31 Plastic 335824B00034G 30.00 30.00 9.40 29.40 9.11 Black anodize 34
35 x 35 Plastic 371824B00034G 35.00 35.00 7.00 31.90 9.67 Black anodize 34
35 x 35 Plastic 374624B00035G 35.00 35.00 10.00 23.40 7.55 Black anodize 35
35 x 35 Plastic 374724B00035G 35.00 35.00 18.00 15.30 5.15 Black anodize 35
35 x 35 Plastic 374824B00035G 35.00 35.00 25.00 12.00 4.27 Black anodize 35
35 x 35 Plastic 372024B00034G 35.00 35.00 27.90 11.90 4.28 Black anodize 34
40 x 40 Plastic 374924B00035G 40.00 40.00 10.00 20.30 6.46 Black anodize 35
40 x 40 Plastic 364424B00034G 40.10 40.00 11.40 18.40 6.02 Black anodize 34
40 x 40 Plastic 375024B00035G 40.00 40.00 18.00 12.20 4.34 Black anodize 35
40 x 40 Plastic 375124B00035G 40.00 40.00 25.00 10.30 3.83 Black anodize 35
BGA–Tape Attachment
Pressure sensitive, thermally conductive adhesive tape
easily and reliably bonds a heat sink to an integrated
circuit package.Tapes provide high thermal conductiv-
ity and exceptional bonding properties. Adhesives are
formulated for plastic and metal/ceramic packages.