MSC0995.PDF ISO 9001 CERTIFIED REV F 11/01/99
8700 E. Thomas Road
Scottsdale, AZ 85251
Tel: (480) 941-6300
Fax: (480) 947-1503
DESCRIPTION
In Microsemi's Powermite
®
surface mount package, these zener diodes
provide power-handling capabilities (3.0 WATTS) found in larger packages.
In addition to its size advantages, Powermite
®
package features include a
full metallic bottom that eliminates the possibility of solder flux entrapment
during assembly, and a unique locking tab acts as an integral heat sink. Its
innovative design makes this device ideal for use with automatic insertion
equipment.
FEATURES
• Surface Mount Packaging
• Integral Heat Sink Locking Tabs
• Compatible with automatic insertion equipment
• Full metallic bottom eliminates flux entrapment
• Zener voltage 3.3 to 200 Volts
• Low reverse leakage
• Tight tolerance available
• ESD Rating of >16kV per human body model
MAXIMUM RATINGS Packaging
• Junction and storage temperatures: -55°C to +150°C •• Tape & Reel EIA Standard 481
• DC power dissipation: 3.0 watt with TAB 1 60°C
• Forward voltage:
@ 200 mA 1.2 volts
Mechanical Specifications Mounting Pad Dimensions
3.0 WATT
Zener Diodes
1PMT5913B
thru
1PMT5956B
MECHANICAL CHARACTERISTICS
• Cathode designated by TAB 1
• Mounting position any way
• Molded package
• Weight: 0.016 gram (approximate)
• Thermal resistance 30°C/W junction to TAB1
PACKAGING
• Tape & Reel EIA Standard 481
• 7 inch 3,000 pieces
CIRCUIT DIAGRAM
All dimensions +/- .005 inches
