Issue 1 - September 2005 1 www.zetex.com
© Zetex Semiconductors plc 2005
Package information - SOT23-5
Surface mounted, 5 pin package
Package outline
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
Soldering footprint
DIM Millimeters Inches
Min. Max. Min. Max.
A 0.90 1.45 0.0354 0.0570
A1 0.00 0.15 0.00 0.0059
A2 0.90 1.30 0.0354 0.0511
b 0.20 0.50 0.0078 0.0196
C 0.09 0.26 0.0035 0.0102
D 2.70 3.10 0.1062 0.1220
E 2.20 3.20 0.0866 0.1181
E1 1.30 1.80 0.0511 0.0708
e 0.95 REF 0.0374 REF
e1 1.90 REF 0.0748 REF
L 0.10 0.60 0.0039 0.0236
a° 0° 30° 0° 30°
2.2
0.087
0.95
0.375
1.06
0.042
0.65
0.025
mm
inches