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DS031 (v3.5) November 5, 2007 www.xilinx.com
Product Specification 1
Module 1:
Introduction and Overview
7pages
• Summary of Features
• General Description
• Architecture
• Device/Package Combinations and Maximum I/O
• Ordering Examples
Module 2:
Functional Description
41 pages
• Detailed Description
- Input/Output Blocks (IOBs)
- Digitally Controlled Impedance (DCI)
- Configurable Logic Blocks (CLBs)
- 18-Kb Block SelectRAM™ Resources
- 18-Bit x 18-Bit Multipliers
- Global Clock Multiplexer Buffers
- Digital Clock Manager (DCM)
•Routing
• Creating a Design
• Configuration
Module 3:
DC and Switching Characteristics
43 pages
• Electrical Characteristics
• Performance Characteristics
• Switching Characteristics
• Pin-to-Pin Output Parameter Guidelines
• Pin-to-Pin Input Parameter Guidelines
• DCM Timing Parameters
• Source-Synchronous Switching Characteristics
Module 4:
Pinout Information
226 pages
• Pin Definitions
•Pinout Tables
- CS144/CSG144 Chip-Scale BGA Package
- FG256/FGG256 Fine-Pitch BGA Package
- FG456/FGG456 Fine-Pitch BGA Package
- FG676/FGG676 Fine-Pitch BGA Package
- BG575/BGG575 Standard BGA Package
- BG728/BGG728 Standard BGA Package
- FF896 Flip-Chip Fine-Pitch BGA Package
- FF1152 Flip-Chip Fine-Pitch BGA Package
- FF1517 Flip-Chip Fine-Pitch BGA Package
- BF957Flip-Chip BGA Package
IMPORTANT NOTE: Page, figure, and table numbers begin at 1 for each module, and each module has its own Revision
History at the end. Use the PDF "Bookmarks" pane for easy navigation in this volume.
1
Virtex-II Platform FPGAs:
Complete Data Sheet
DS031 (v3.5) November 5, 2007 Product Specification
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