100% Material Declaration
Data Sheet
HQ304
PK213 (v1.0) October 18, 2006 Material Declaration Data Sheet
Average Weight: 28.511 g
Component Substance
Description
CAS# or
Description
% of
Component
Use in Product Component Weight/
Substance Weight
(in grams)
Component %
of Total
Silicon Die
0.15449 0.58%
Silicon 7440-21-3 100.00
0.15449
Die Attach
Material
0.01427 0.05%
Silver 7440-22-4 75.00 0.010699
Epoxy (EP) Trade Secret 25.00 0.003566
Mold
Compound
7.45805 28.13%
Epoxy Resin (EP) Trade Secret 15.00 1.118708
Silica 60676-86-0 85.00 6.339344
Leadframe
0.90153 3.40%
Copper 7440-50-8 96.20 0.867270
Nickel 3.00 0.027046
Silicon 0.65 0.005860
Magnesium 0.15 0.001352
Leadframe
Plating
0.00155 0.01%
Silver 7440-22-4 100.00 0.00155
Heat Slug
17.87660 67.43%
Copper 7429-50-8 100.00 17.87660
Ext. Heat Sink
plating
0.01157 0.04%
Nickel 7440-02-0 100.00 0.01157
Bond Wire
0.01231 0.05%
Gold 7440-57-5 100.00 0.01231
Ext. Plating
0.05572 0.21%
Tin 7440-31-5 85.00
0.047361
Lead 7439-92-1 15.00
0.008358
PK213 (v1.0) October 18, 2006 www.xilinx.com 1
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