2006. 5. 16 1/2Revision No : 1
FEATURES
Plastic package has Underwriters Laboratory flammability
Classification 94V-0.
For surface mounted aplications.
Low profile package.
Built-in strain relief, ideal for automated placement.
Glass passivated chip junction.
High temperature soldering guaranteed
: 250
/10 seconds at terminals.
MAXIMUM RATING (Ta=25 )
ELECTRICAL CHARACTERISTICS (Ta=25 )
Note 1) Thermal resistance from junction to ambient and from junction to lead mounted
on P.C.B with (5.0
5.0mm) copper pads.
SEMICONDUCTOR
TECHNICAL DATA
GN1G
Surface Mount Glass Passivated Rectifier
CHARACTERISTIC SYMBOL RATING UNIT
Repetitive peak reverse voltage
V
RRM
400 V
RMS voltage
V
RMS
280 V
DC blocking voltage
V
DC
400 V
Average forward rectified current
(see fig.1)
I
F(AV)
1A
Peak forward surge current 8.3ms single
half sine-wave superimposed on rated
load (JEDEC Method) T
L
=110
I
FSM
40 A
Operating Junction and
Storage Temperature Range
Tj, Tstg -55~150
CHARACTERISTIC SYMBOL CONDITION MIN TYP MAX UNIT
Forward voltage
V
F
I
F
=1A
- - 1.1 V
Leakage current
Ta=25
I
R
V
RRM
=400V
- - 1.0
A
Ta=125
- - 50
Reverse recovery time
t
rr
I
F
=0.5A, I
R
=1.0A
- 1.8 -
S
Junction capacitance
C
J
V
R
=4.0V, f=1MHz
- 12 - pF
Thermal resistance
R
th
(A)
(Note1)
Junction to ambient - - 75
/W
R
th
(L)
Junction to lead - - 27
