GL550/GL551
(Ta=25˚C)
(
2.54
)
1
2
1
2
GL550
31.5± 2
(
2.5
)
GL551
33± 2
(
4.3
)
φ 5.0
± 0.2
1.5
MAX.
7.4
± 0.2
0.8
± 0.1
0.5
± 0.1
2.0
± 1.5
φ 5.0
± 0.2
0.5
± 0.1
I
F
100 mA
I
FM
1A
V
R
4V
P 190 mW
T
opr
˚C
T
stg
˚C
T
sol
260 ˚C
High Speed Infrared Emitting
Diode
Features
Applications
Outline Dimensions
(Unit : mm)
1. High speed response
Response frequency fc : TYP. 12MHz
2. Intermediate beam angle and narrow beam angle
GL550 half intensity angle : TYP. ± 22˚
GL551 half intensity angle : TYP. ± 10˚
1. Audio equipment
2. AV equipment
Transparent
epoxy resin
Protruded resin
Without
plating
(
1.0
)
1 Anode
2 Cathode
* ( ) : Reference dimensions
Absolute Maximum Ratings
Parameter Symbol Rating Unit
Forward current
Peak forward current
Reverse voltage
Power dissipation
Operating temperature
Storage temperature
Soldering temperature
*1
*2
-20to+85
- 30 to + 100
GL550/GL551
* 2
* 1
* 1 Dim. (mm) * 2 Dim. (mm)
*1 Pulse width 100 µ s, Duty ratio=0.01
*2 For MAX. 3 seconds at the position of 3.0 mm from the resin edge
3. High output type optical output : TYP. 15mW
data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.”
“ In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs,
■
■
■
■