*1 Pulse width<=100 µ s, Duty ratio= 0.01
*2 For 3 seconds at the position of 1.4mm from the bottom face of resin package.
■ Features
I
F
= 20mA
)
■ Applications
GL480/GL480Q
GL483Q
3. Compact, high reliability by chip coating
GL480/GL480Q/GL483Q
1. Narrow beam angle
(
∆θ : TYP. ± 13˚
)
2. Radiant flux
(
Φ e : MIN. 0.7mW at
0.15
0.75
1.15
Rest of
gate
1.7
1.7
gate
Rest of
epoxy resin
Transparent
1.15
0.75
0.15
2.54
2.8
1.6
60˚
1.6
2.8
2- C0.5
2- 0.4
2- C0.5
2- 0.6
2 - 0.4
GL483Q
■ Absolute Maximum Ratings
(
Ta= 25˚C
)
■ Outline Dimensions
(
Unit : mm
)
Pink transparent
epoxy resin
(
GL480
)
1
2
Parameter Symbol Rating Unit
Power dissipation P 75 mW
Forward current I
F
50 mA
*1
Peak forward current I
FM
1A
Reverse voltage V
R
6V
Operating temperature T
opr
- 25 to + 85
˚C
Storage temperature T
stg
- 40 to + 85
˚C
*2
Soldering temperature T
sol
260 ˚C
1 Cathode
2 Anode
4.0± 0.2
4. Long lead type
(
GL483Q
)
1 Cathode
2 Anode
1
2
2
1
1.5
4.0 ± 0.2
40.0 ± 1
3.0
18.5
2.54
60˚
GL480/GL480Q
data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.”
“ In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs,
epoxy resin
(
GL480Q
)
Emitter center
1.5
1
2
Emitter center
Infrared Emitting Diode
2. Floppy disk drives
3. Optoelectronic switches
1. Copiers
Transparent
R0.8
± 0.1
3.0
± 0.2
0.8
MAX.
0.5
MIN.
2.95
± 0.2
2.15
± 0.2
17.5
+ 1.5
- 1.0
0.3
MAX.
2.95
± 0.2
2.15
± 0.2
0.5
MIN.
0.8
MAX.
0.3
MAX.
1.6
± 0.2
3.0
± 0.2
(
GL480Q/GL483Q
)