(Ta=25˚C)
I
F
50 mA
I
FM
A
V
R
V
PmW
T
opr
˚C
T
stg
˚C
T
sol
260 ˚C
1
6
75
1.4mm
3.0
4.0
2.8
1.8
0.7
0.7
0.15
4˚
4˚
4˚
4˚
6˚6˚
6˚
6˚
(
1.7
)
2 - C0.5
(
2.54
)
2
1
1.4
2
1
1.4
0.9
MAX.
0.3
MAX.
0.1
MAX.
0.5
MIN.
2 - 0.45
+ 0.3
- 0.1
2 - 4
+ 0.3
- 0.1
17.5
+ 15
- 10
Features
Applications
Parameter Symbol Rating Unit
Forward current
Peak forward current
Reverse voltage
Power dissipation
Operating temperatur
Storage temperature
Soldering temperature
*1
*2
-25to+85
-40to+85
Outline Dimensions
(Unit : mm)
Rugged resin
Rugged resin 0.2
MAX.
Gate burr
Detector center
Pale red transparent
epoxy resin
1 Anode
2 Cathode
* ( ) : Reference dimensions
* Tolerance : ± 0.2 mm
Soldering area
Absolute Maximum Ratings
GL4100
GL4100
Side View and Thin Flat Type
Infrared Emitting Diode
* 1 Pulse width <=100µ s, Duty ratio=0.01
* 2 For 5 seconds at the position of 1.4 mm from the resin edge
1. Compact flat package
2. Wide beam angle
(Half intensity angle : ± 90˚ )
1. Mouses
2. Track balls
data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.”
“ In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs,
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