100% Material Declaration
Data Sheet
FGG860
PK113 (v1.2) September 22, 2006 Material Declaration Data Sheet
Average Weight: 10.904 g
Component Substance
Description
CAS# or
Description
% of
Component
Use in Product Component Weight/
Substance Weight
(in grams)
Component %
of Total
Silicon Die
0.1201 1.10%
Silicon 7440-21-3 100.00 0.1201
Die Attach
Material
0.012 0.11%
Silver 7440-22-4 75.00 0.009
Resin Trade Secret 25.00 0.003
Mold
Compound
0.4135 7.31%
Epoxy Resins Trade Secret 26.00 0.207
SiO2 60676-86-0 74.00 Filler 0.590
Laminate
0.7897 7.24%
Laminate Trade Secret 0.481
Solder Mask Trade Secret 0.168
Copper 7440-50-8 Metal Layer 0.122
Nickel 7440-02-0 Metal Layer 0.014
Gold 7440-57-5 Metal Layer 0.005
Heat Sink
7.0645 64.79%
Copper 7440-50-8 97.50 6.888
Iron 7439-89-6 2.35 0.166
Phosphorus 7723-14-0 0.003 0.0002
Zinc 7440-66-6 0.12 0.008
Heat Snk
Plating
0.3292 3.02%
Nickel 7440-05-0 100.00 0.3292
Dam
0.0148 0.13%
Epoxy Resin Trade Secret 100.00 0.0.148
Bond Wire
0.0236 0.22%
Gold 7440-57-5 100.00 0.0236
Solder Balls
1.752 16.07%
Tin 7440-31-5 95.50 1.67316
Silver 7440-22-4 4.00 0.07008
Copper 7440-50-8 0.50 0.00876
PK113 (v1.2) September 22, 2006 www.xilinx.com 1
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