100% Material Declaration
Data Sheet
VO20
PK175 (v1.0) October 5, 2006 Material Declaration Data Sheet
Average Weight: 0.1 g
Component Substance
Description
CAS# or
Description
% of
Component
Use in Product Component Weight/
Substance Weight
(in grams)
Component %
of Total
Silicon Die
0.00999 9.99%
Silicon 7440-21-3 100.00 0.00999
Die Attach
Material
0.0026 2.60%
Silver 7440-22-4 77.00 0.002002
Epoxy (EP) Trade Secret 23.00 0.000598
Mold
Compound
0.04918 49.18%
Epoxy Resin (EP) Trade Secret 9.00 0.0044262
Phenolic Resin Trade Secret 7.00 0.0034426
Carbon Black 1333-86-4 0.50 0.0002459
Silica 60676-86-0 82.50 0.0405735
Bismuth 7440-69-9 Max 1.00 0.0004918
Leadframe
0.035 35.00%
Copper 7440-50-8 97.50 0.034125
Iron 7439-89-6 2.35 0.0008225
Phosphorus 7723-14-0 0.03 0.0000105
Zinc 7440-66-6 0.12 0.000042
Leadframe
Plating
0.00008 0.08%
Silver 7440-22-4 100.00 0.00008
Bond Wire
0.00053 0.53%
Gold 7440-57-5 99.9973 0.00052998569
Silver 7440-22-4 0.0005 0.00000000265
Calcium 7440-70-2 0.0022 0.00000001166
Ext. Plating
0.00262 2.62%
Tin 7440-31-5 85.00 0.002227
Lead 7439-92-1 15.00 0.000393
PK175 (v1.0) October 5, 2006 www.xilinx.com 1
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