PK454 (v1.0) January 28,
2011
100% Material Declaration Data Sheet FGG1156
PK454 (v1.0) January 28, 2011 www.xilinx.com
1
Average Weight: 5.4930 g
Component Substance
Description
CAS# or
Description
% of
Component
Use in Product Component Weight/
Substance Weight
(in grams)
Component %
of Total
Silicon Die
0.256153 4.663%
Silicon 7440-21-3 100.00 0.256153
Die Attach
Material
0.072582 1.321%
Silver 7440-22-4 77.50 0.056251
Bismaleimide
monomer
Trade Secret 15.00 0.010887
Acrylate monomer Trade Secret 7.50 0.005444
Mold
Compound
2.292107 41.728%
Epoxy Resin A Trade Secret 3.00 0.068763
Epoxy Resin B Trade Secret 3.00 0.068763
Phenol Resin A Trade Secret 3.00 0.068763
Phenol Resin B Trade Secret 3.00 0.068763
Metal Hydroxide Trade Secret 1.50 0.034382
Carbon Black 1333-86-4 0.30 0.006876
Silica Fused 60676-86-0 70.90 1.625104
Silica Fused 7631-86-9 15.00 0.343816
Silica, crystalline 14808-60-7 0.30 0.006876
Gold Wire
0.029878 0.544%
Gold 7440-57-5 99.05 0.029594
Palladium 7440-05-3 0.95 0.000284
Calcium 7440-70-2 0.00 0.000001
Solder Balls
0.968296 17.628%
Tin 7440-31-5 96.50 0.924723
Silver 7440-22-4 3.00 0.038732
Copper 7440-50-8 0.50 0.004841
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