PK550 (v1.1) January 25, 2013 www.xilinx.com 1
PK550 (v1.1) January 25, 2013
100% Material Declaration Data Sh eet for
7 Series FFG901
Average Weight: 10.1290g
Component Substance
Description
CAS Number
or
Description
Percentage
of
Component
Use in Product Component We ight/
Substance We ight
(grams)
Component
Percent of
Total
Silicon Die
0.446519 4.408
Silicon (Si) 7440-21-3 100.00 Basis 0.446519
Solder Bump
0.029370 0.290
Tin (Sn) 7440-31-5 63.00 Basis 0.018503
Lead (Pb) 7439-92-1 37.00 Basis 0.010867
Solder Paste
0.071000
0.701
Tin (Sn) 7440-31-5 96.50 Basis 0.068515
Silver (A g) 7440-22-4 3.00 Basis 0.002130
Copper (Cu) 7440-50-8 0.50 Basis 0.000355
0.037800
0.373
BaTiO3 type 12047-27-7 70.60 Ceramic 0.026687
Nick el (Ni ) 7440-02-0 6.70 Inner electrode 0.002533
Copper (Cu) 7440-50-8 20.10 Outer electrode 0.007598
Nick el (Ni ) 7440-02-0 0.80 Plating 1 0.000302
Tin (Sn) 7440-31-5 1.80 Plat i ng 2 0.000680
0.007360
0.073
BaTiO3 type 12047-27-7 51.10 Ceramic 0.003761
Nick el (Ni ) 7440-02-0 27.00 Inner electrode 0.001987
Copper (Cu) 7440-50-8 16.00 Outer electrode 0.001178
Glass 65997-17-3 0.90 0.000066
Nick el (Ni ) 7440-02-0 2.00 Plating 1 0.000147
Tin (Sn) 7440-31-5 3.00 Plat i ng 2 0.000221
0.004200
0.041
BaTiO3 type 12047-27-7 66.00 Ceramic 0.002772
Nick el (Ni ) 7440-02-0 2.67 Inner electrode 0.000112
Copper (Cu) 7440-50-8 23.33 Outer electrode 0.000980
Nick el (Ni ) 7440-02-0 2.33 Plating 1 0.000098
Tin (Sn) 7440-31-5 5.67 Plat i ng 2 0.000238
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