PK524 (v1.2) October 12, 2012 www.xilinx.com
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PK524 (v1.2) October 12, 2012
100% Mat erial Declaration Data She et for
7 Series
FFG900
Average Weight: 11.5795g
Component Substance
Description
CAS Number
or
Description
Percentage
of
Component
Use in Product Component We ight/
Substance We ight
(grams)
Component
Percent of
Total
Silicon Die
0.296758 2.563
Silicon (Si) 7440-21-3 100.00 Basis 0.296758
Solder Bump
0.019315 0.167
Tin (Sn) 7440-31-5 63.00 0.012168
Lead (Pb) 7439-92-1 37.00 0.007147
Solder Paste
0.071000 0.613
Tin (Sn) 7440-31-5 96.50 Basis 0.068515
Silver (A g) 7440-22-4 3.00 Basis 0.002130
Copper (Cu) 7440-50-8 0.50 Basis 0.000355
Capacitor 1
0.023400
0.202
BaTiO3 type 12047-27-7 70.60 Ceramic 0.016520
Nick el (Ni ) 7440-02-0 6.70 Inner electrode 0.001568
Copper (Cu) 7440-50-8 20.10 Outer electrode 0.004703
Nick el (Ni ) 7440-02-0 0.80 Plating 1 0.000187
Tin (Sn) 7440-31-5 1.80 Plat i ng 2 0.000421
Capacitor 2
0.003800
0.033
BaTiO3 type 12047-27-7 61.70 Ceramic 0.002345
Nick el (Ni ) 7440-02-0 4.89 Inner electrode 0.000186
Indium tin oxide 50926-11-9 18.30 Outer electrode 0.000695
Copper (Cu) 7440-50-8 13.40 Outer electrode 0.000509
Nickel (Ni) 7440-02-0 0.49 Plati ng 1 0.000019
Tin (Sn) 7440-31-5 1.22 Plat i ng 2 0.000046
Capacitor 3
0.002400
0.021
BaTiO3 type 12047-27-7 66.00 Ceramic 0.001584
Nick el (Ni ) 7440-02-0 2.67 Inner electrode 0.000064
Copper (Cu) 7440-50-8 23.33 Outer electrode 0.000560
Nick el (Ni ) 7440-02-0 2.33 Plating 1 0.000056
Tin (Sn) 7440-31-5 5.67 Plat i ng 2 0.000136
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