PK092 (v1.3) July 20, 2010 www.xilinx.com 1
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Average Weight: 11.2g
PK092 (v1.3) July 20, 2010
100% Material Declaration Data Sheet
FFG896
Component
Substance
Description
CAS Number
or
Description
Percentage of
Component
Use in
Product
Component
Weight/
Substance Weight
(grams)
Component
Perc ent of Total
Silicon Die 0.50736 4.53
Silicon 7440-21-3 100.00 0.50736
Solder Bump 0.00336 0.03
Tin 7440-31-5 63.00 0.0021168
Lead 7439-92-1 37.00 0.0012432
Underfill 0.05824 0.52
Silica 60676-86-0 70.00 0.040768
Epoxy Resin A 9003-36-5 20.00 0.011648
Epoxy Resin B 25068-38-6 3.00 0.0017472
Hardener 19900-65-3 7.00 0.0040768
Heat Sink 7.32928 65.44
Copper 7440-50-8 99.97 7.327081216
Nickel 7440-02-0 0.03 0.002198784
Solder Paste 0.05264 0.47
Tin 7440-31-5 95.50 0.0502712
Silver 7440-22-4 4.00 0.0021056
Copper 7440-50-8 0.50 0.0002632
Substrate 2.46512 22.01
Copper 7440-50-8 47.61 Metal layer 1.173643632
Nickel 7440-02-0 0.51 Metal layer 0.012572112
Gold 7440-57-5 0.11 Metal layer 0.002711632
BT (core) N/A 27.54 0.678894048
Glass fiber N/A 10.35 0.25513992
Halogen fire
retardant
N/A 5.25 0.1294188
Solder mask N/A 8.63 0.212739856
Solder Balls 0.784 7.00
Tin 7440-31-5 95.50 0.74872
Silver 7440-22-4 4.00 0.03136
Copper 7440-50-8 0.50 0.00392
