PK427 (v1.2) October 19, 2012 www.xilinx.com
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PK427 (v1.2) Oc tober 19, 2 012
100% Materi al Decla rat ion Data Sheet for
FFG1759 Virtex®-6
Average Weight: 20.8072 g
Component
Substance
Description
CAS Number
or
Description
Percentage
of
Component
Use in Product
Component We ight/
Substance We ight
(grams)
Component
Percent of Total
Silicon Die
Silicon IC
0.935666
4.497
Doped silicon 7440-21-3 100.00 Basis 0.935666
Solder Bump
Die to package
0.048899 0.235
Tin 7440-31-5 63.00 Basis 0.030806
Lead 7439-92-1 37.00 Basis 0.018093
Die Under fill
0.130000 0.625
Bisphenol F-type
liquid epoxy resin
9003-36-5 20.00 Basis 0.026000
Phenolic resi n Trade secret 15.00 Basis 0.019500
Bisphenol A-type
liquid epoxy resin
25068-38-6 5.00 Basis 0.006500
Amine type
accelerator
Trade secret 5.00 Basis 0.006500
Silicon dioxide 60676-86-0 51.50 Basis 0.066950
Carbon black 1333-86-4 1.00 Basis 0.001300
Additives Trade secret 2.50 Basis 0.003250
Substrate
5.886081 28.289
Copper 7440-50-8 35.78 Main material 2.106128
Tin 7440-31-5 0.89 Main material 0.052415
Lead 7439-92-1 0.19 Main material 0.011172
Silver 7440-22-4 0.02 Main material 0.001084
BT Core N/A 42.35 Main material 2.492625
ABF N/A 19.64 Main material 1.156000
Soldermask N/A 1.13 Main material 0.066657
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