PK098 (v1.2) July 20 2010 www.xilinx.com 1
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Average Weight: 18.5461g
PK098 (v1.2) July 20 2010
100% Material Declaration Data Sheet
FFG1704
Component
Substance
Description
CAS Number
or
Description
Percentage of
Component
Use in
Product
Component
Weight/
Substance Weight
(grams)
Component
Percent of Total
Silicon Die 1.187220 6.401
Silicon 7440-21-3 100.00 1.187220
Solder Bump 0.021443 0.116
Tin 7440-31-5 63.00 0.013509
Lead 7439-92-1 37.00 0.007934
Underfill 0.135000 0.728
Silica 60676-86-0 70.00 0.094500
Epoxy Resin A 9003-36-5 20.00 0.027000
Epoxy Resin B 25068-38-6 3.00 0.004050
Hardener 19900-65-3 7.00 0.009450
Heat Spreader 13.300000 71.713
Copper 7440-50-8 99.90 13.286700
Nickel 7440-02-0 0.10 0.013300
Heat Spreader
Adhesive
0.125800 0.678
Organopolysiloxane
mixture
N/A 100.00 0.125800
Substrate 2.353223 12.688
Copper 7440-50-8 47.61 Metal layer 1.120381
Nickel 7440-02-0 0.51 Metal layer 0.012002
Gold 7440-57-5 0.11 Metal layer 0.002589
Glass fiber N/A 10.35 0.243561
Halogen fire
retardant
N/A 5.25 Flame retardant 0.123451
BT (core) N/A 27.54 0.648155
Solder mask N/A 8.63 0.203085
Solder Balls 1.423460 7.675
Tin 7440-31-5 95.50 1.359404
Silver 7440-22-4 4.00 0.056938
Copper 7440-50-8 0.50 0.007117