PK556 (v1.1) N ov ember 23, 2 012 www.xilinx.com
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PK556 (v1.1) November 23, 2012
100% Material Declaration Data Sheet for
7 Series FFG1157
Average Weight: 13.6002g
Component Substance
Description
CAS Number
or
Description
Percentage
of
Component
Use in Product Component We ight/
Substance We ight
(grams)
Component
Percent of
Total
Silicon Die
0.828955
6.095
Silicon (Si) 7440-21-3 100.00 Basis 0.828955
Solder Bump
0.038857 0.286
Tin (Sn) 7440-31-5 63.00 Basis 0.024480
Lead (Pb) 7439-92-1 37.00 Basis 0.014377
Solder Paste
0.011300 0.083
Tin (Sn) 7440-31-5 96.50 Basis 0.010905
Silver (A g) 7440-22-4 3.00 Basis 0.000339
Copper (Cu) 7440-50-8 0.50 Basis 0.000057
0.041280
0.304
BaTiO3 type 12047-27-7 70.60 Ceramic 0.029144
Nick el (Ni ) 7440-02-0 6.70 Inner electrode 0.002766
Copper (Cu) 7440-50-8 20.10 Outer electrode 0.008297
Nick el (Ni ) 7440-02-0 0.80 Plating 1 0.000330
Tin (Sn) 7440-31-5 1.80 Plat i ng 2 0.000743
0.015200
0.112
BaTiO3 type 12047-27-7 61.70 Ceramic 0.009378
Nick el (Ni ) 7440-02-0 4.89 Inner electrode 0.000743
Indium tin oxide 50926-11-9 18.30 Outer elect rode 0.002782
Copper (Cu) 7440-50-8 13.40 Outer electrode 0.002037
Nick el (Ni ) 7440-02-0 0.49 Plating 1 0.000074
Tin (Sn) 7440-31-5 1.22 Plat i ng 2 0.000185
0.003000 0.022
BaTiO3 type 12047-27-7 66.00 Ceramic 0.001980
Nick el (Ni ) 7440-02-0 2.67 Inner electrode 0.000080
Copper (Cu) 7440-50-8 23.33 Outer electrode 0.000700
Nick el (Ni ) 7440-02-0 2.33 Plating 1 0.000070
Tin (Sn) 7440-31-5 5.67 Plat i ng 2 0.000170
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