100% Material Declaration Data Sheet for FFG1148
PK093 (v1.4) May 13, 2016
Substance Description
CAS # or Description % of Component Use in product Component Weight Component % of total
Silicon
7440-21-3 100.000 0.694500
Tin
7440-31-5 63.000 0.022753
Lead
7439-92-1 37.000 0.013363
Silica
60676-86-0 70.000 0.051800
Epoxy Resin A
9003-36-5 20.000 0.014800
Epoxy Resin B
25068-38-6 3.000 0.002220
Hardener
19900-65-3 7.000 0.005180
Copper
7440-50-8 99.900 5.994000
Nickel
7440-02-0 0.100 0.006000
Organopolysiloxane mixture
NA 100.000 0.130000
Tin
7440-31-5 95.500 0.915845
Silver
7440-22-4 4.000 0.038360
Copper
7440-50-8 0.500 0.004795
Copper
7440-50-8 50.17 metal layer 1.492713
Tin
7440-31-5 0.76 metal layer 0.022612
Lead
7439-92-1 0.15 metal layer 0.004463
Silver
7440-22-4 0.02 0.000595
Solder Mask
N/A 2.30 0.068432
Date Version Description of Revisions
03/14/2006
1.0 Initial Initial release.
06/01/2006
1.1 100% Material Declaration.
Updated component
descriptions.
Updated Heat Spreader
substance description
05/13/2016 1.4 Updated substrate
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completeness, including, but not limited to, with respect to its compliance with applicable
environmental laws and regulations. Xilinx subcontracts the production, test and assembly of
hardware devices to independent third-party vendors and materials suppliers (“Contractors”).
All data provided hereunder is based on information received from Contractors. Xilinx has not
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solely for your reference in connection with the use of Xilinx products.
