PK562 (v1.1) October 12, 2012 www.xilinx.com
1
PK562 (v1.1) October 12, 2012
100% Material Declaratio n Dat a S heet for
7 Series FF901
Average Weight: 10.2338g
Component Substance
Description
CAS Number
or
Description
Percentage
of
Component
Use in Product Component We ight/
Substance We ight
(grams)
Component
Percent of
Total
Silicon Die
0.446519 4.363
Silicon (Si) 7440-21-3 100.00 Basis 0.446519
Solder Bump
0.029370 0.287
Tin (Sn) 7440-31-5 63.00 Basis 0.018503
Lead (Pb) 7439-92-1 37.00 Basis 0.010867
Solder Paste
0.071000
0.694
Tin (Sn) 7440-31-5 96.50 Basis 0.068515
Silver (A g) 7440-22-4 3.00 Basis 0.002130
Copper (Cu) 7440-50-8 0.50 Basis 0.000355
Capacitor 1
0.037800
0.369
BaTiO3 type 12047-27-7 70.60 Ceramic 0.026687
Nick el (Ni ) 7440-02-0 6.70 Inner electrode 0.002533
Copper (Cu) 7440-50-8 20.10 Outer electrode 0.007598
Nick el (Ni ) 7440-02-0 0.80 Plating 1 0.000302
Tin (Sn) 7440-31-5 1.80 Plat i ng 2 0.000680
Capacitor 2
0.007360
0.072
BaTiO3 type 12047-27-7 51.10 Ceramic 0.003761
Nick el (Ni ) 7440-02-0 27.00 Inner electrode 0.001987
Copper (Cu) 7440-50-8 16.00 Outer electrode 0.001178
Glass 65997-17-3 0.900 0.000066
Nick el (Ni ) 7440-02-0 2.00 Plating 1 0.000147
Tin (Sn) 7440-31-5 3.00 Plat i ng 2 0.000221
Capacitor 3
0.004200
0.041
BaTiO3 type 12047-27-7 66.00 Ceramic 0.002772
Nick el (Ni ) 7440-02-0 2.67 Inner electrode 0.000112
Copper (Cu) 7440-50-8 23.33 Outer electrode 0.000980
Nickel (Ni) 7440-02-0 2.33 Plati ng 1 0.000098
Tin (Sn) 7440-31-5 5.67 Plat i ng 2 0.000238
© Copyright 2012 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and
other countries. All other trademarks are the property of their respective owners
