100% Material Declaration
Data Sheet
FF323
PK234 (v1.0) December 12, 2007 Material Declaration Data Sheet
Average Weight: 2.8477 g
Component Substance
Description
CAS# or
Description
% of
Component
Use in Product Component Weight/
Substance Weight
(in grams)
Component %
of Total
Silicon Die
0.000010 0.000%
Silicon 7440-21-3 100.00 0.000010
Solder Bump
0.016860 0.592%
Tin 7440-31-5 63.00 0.010622
Lead 7439-92-1 37.00 0.006238
Underfill
0.056000 1.966%
Silica 60676-86-0 70.00 0.039200
Epoxy Resin A 9003-36-5 20.00 0.011200
Epoxy Resin B 25068-38-6 3.00 0.001680
Hardener 19900-65-3 7.00 0.003920
Heat Spreader
1.100000 38.627%
Copper 7440-50-8 99.60 1.095600
Nickel 7440-02-0 0.40 0.004400
Heat Spreader
Adhesive
0.031000 1.089%
Organopolysiloxane
mixture
N/A 100.00 0.031000
Substrate
1.343877 47.191%
Copper 7440-50-8 47.61 Metal Layer 0.639826
Nickel 7440-02-0 0.51 Metal Layer 0.006854
Gold 7440-57-5 0.11 Metal Layer 0.001478
Glass fiber N/A 10.35 0.139093
Halogen fire retardant N/A 5.25 0.070500
BT (core) N/A 27.54 0.370148
Solder Mask N/A 8.63 0.115978
Solder Balls
0.300000
10.535%
Tin 7440-31-5 63.00 0189000
Lead 7439-91-1 37.00 0.11100
PK234 (v1.0) December 12, 2007 www.xilinx.com 1
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