PK680 (v1.0) July 18, 2014 www.xilinx.com 1
PK680 (v1.0) July 18, 2014
100% Material Declaration Data Sheet for
7 Series FB676
Average Weight: 2.9376g
Component Substance
Description
CAS Number
or
Description
Percentage
of
Component
Use in Product Component We ight/
Substance We ight
(grams)
Component
Percent of
Total
Silicon Die
0.388303 13.218
Silicon (Si) 7440-21-3 100.00 Basis 0.388303
Solder Bump
0.018136
0.617
Tin (Sn) 7440-31-5 63.00 Basis 0.011426
Lead (Pb) 7439-92-1 37.00 Basis 0.006710
Solder Paste
0.003700 0.126
Tin (Sn) 7440-31-5 96.50 Basis 0.003571
Silver (A g) 7440-22-4 3.00 Basis 0.000111
Copper (Cu) 7440-50-8 0.50 Basis 0.000019
Capacitor 1
0.010800
0.368
BaTiO3 type 12047-27-7 70.60 Ceramic 0.007625
Nick el (Ni ) 7440-02-0 6.70 Inner electrode 0.000724
Copper (Cu) 7440-50-8 20.10 Outer electrode 0.002171
Nick el (Ni ) 7440-02-0 0.80 Plating 1 0.000086
Tin (Sn) 7440-31-5 1.80 Plat i ng 2 0.000194
Capacitor 2
0.001200
0.041
BaTiO3 type 12047-27-7 66.00 Ceramic 0.000792
Copper (Cu) 7440-50-8 2.67 Inner electrode 0.000032
Nick el (Ni ) 7440-02-0 23.33 Outer electrode 0.000280
Nick el (Ni ) 7440-02-0 2.33 Plating 1 0.000028
Tin (Sn) 7440-31-5 5.67 Plat i ng 2 0.000068
Capacitor 3
0.007440
0.253
BaTiO3 type 12047-27-7 51.10 Ceramic 0.003802
Nick el (Ni ) 7440-02-0 27.00 Inner electrode 0.002009
Copper (Cu) 7440-50-8 16.00 Outer electrode 0.001190
Glass 65997-17-3 0.90 Plating1 0.000067
Nick el (Ni ) 7440-02-0 2.00 Plating 1 0.000149
Tin (Sn) 7440-31-5 3.00 Plat i ng 2 0.000223
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