© 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FAN53600 / FAN53610 • Rev. 1.0.0 3
FAN53600 / FAN53610 — 3MHz, 600mA / 1A Synchronous Buck Regulator
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above
the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended
exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings
are stress ratings only.
Symbol Parameter Min. Max. Unit
V
IN
Input Voltage –0.3 7.0 V
V
SW
Voltage on SW Pin –0.3 V
IN
+ 0.3
(3)
V
V
CTRL
EN and MODE Pin Voltage –0.3 V
IN
+ 0.3
(3)
V
Other Pins –0.3 V
IN
+ 0.3
(3)
V
ESD
Electrostatic Discharge
Protection Level
Human Body Model per JESD22-A114 3.5
kV
Charged Device Model per JESD22-C101 1.5
T
J
Junction Temperature –40 +150 °C
T
STG
Storage Temperature –65 +150 °C
T
L
Lead Soldering Temperature, 10 Seconds +260 °C
Note:
3. Lesser of 7 V or V
IN
+0.3 V.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating
conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding
them or designing to Absolute Maximum Ratings.
Symbol Parameter Min. Typ. Max. Unit
V
CC
Supply Voltage Range 2.3 5.5 V
I
OUT
Output Current
FAN53600 0 600 mA
FAN53610 0 1 A
L Inductor 1 µH
C
IN
Input Capacitor 2.2 µF
C
OUT
Output Capacitor V
OUT
<2.7 V 1.6 4.7 12.0 µF
V
OUT
≥2.7 V 10
T
A
Operating Ambient Temperature –40 +85 °C
T
J
Operating Junction Temperature –40 +125 °C
Thermal Properties
Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with two-layer 1s2p
boards in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction temperature T
J(max)
at a
given ambient temperature T
A
.
Symbol Parameter Typical Unit
θ
JA
Junction-to-Ambient Thermal Resistance 150 °C/W
