SEATING PLANE
0.06 C
0.05
C
C
SIDE VIEWS
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASMEY14.5M, 2009.
D. DATUM C, THE SEATING PLANE IS DEFINED
BY THE SPHERICAL CROWNS OF THE BALLS.
E. PACKAGE TYPICAL HEIGHT IS 586 MICRONS
±39 MICRONS (547-625 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y, SEE
PRODUCT DATASHEET.
G. DRAWING FILENAME: MKT-UC006ACrev6.
BOTTOM VIEW
TOP VIEW
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
E
D
B
A
BALL A1
INDEX AREA
A1
0.03
C
2X
0.03 C
2X
0.208±0.021
0.378±0.018
1
2
A
B
C
0.40
0.40
0.005 C A B
(X) +/-0.015
(Y) +/-0.015
Ø0.260±0.010
0.40
6X
E
D
F
F
0.40
(Ø0.20)
Bottom of Cu Pad
(Ø0.30)
Solder Mask
Opening
F
0.586±0.039